I. Introduction
With the increasing demand for millimeter-wave wireless systems, the components based on the traditional transmission lines are facing challenges in realizing a low loss, high integration, effective cost, and stable circuit performance at high frequencies. The hollow waveguide has the advantage of low loss and high quality factor, but it is bulky and difficult to be integrated with RF circuits. Microstrip suffers from radiation losses, surface waves, and undesired cavity modes produced by the metal box shielding [1]. For the stripline, any vertical asymmetry between the two ground planes will cause the unwanted higher order modes [2]. Substrate-integrated waveguide (SIW) is a self-packaged structure realizing a metal waveguide in the planar form. Since electromagnetic (EM) waves mainly propagate in the dielectric, SIW suffers from severe dielectric losses at high frequencies [3]. Therefore, air-filled self-packaged multilayer printed circuit board (PCB)-based transmission lines, such as air-filled SIW (AF-SIW) [4], substrate-integrated suspended line (SISL) [5], DSISL [6], and empty substrate-integrated coaxial line (SICL) [7], have been presented to achieve low loss. However, energy leakages are inevitable at high frequencies due to the possible poor electrical contacts between plates, especially at discontinuities.