1. Introduction
Although commercial reliability standards are required by all high temperature electronic components, not many studies of high temperature reliability have been documented in periodicals or journals. The High Temperature Electronic Conferences have been the main forums for such publications [1]–[11]. Previous studies have concentrated on interconnections [1], reliability modeling [2], [5], metallization studies [4], [6], passive components [11], and high temperature reliability studies of active devices [3], [7], [8], [9], [10].