Semiconductor device reliability in extreme high temperature space environments | IEEE Conference Publication | IEEE Xplore

Semiconductor device reliability in extreme high temperature space environments


Abstract:

Reliability at high temperatures is one of the most important problems for electronic components operating in extreme space environments. High temperature operation not o...Show More

Abstract:

Reliability at high temperatures is one of the most important problems for electronic components operating in extreme space environments. High temperature operation not only reduces the performance of electronic devices, but also greatly shortens their lifetime. The electronic devices are usually designed for room temperature performance. In this paper a review is made of high temperature reliability testing of solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. Comprehensive high temperature reliability studies will be required to field high temperature devices for future space exploration.
Date of Conference: 10-17 March 2001
Date Added to IEEE Xplore: 07 August 2002
Print ISBN:0-7803-6599-2
Conference Location: Big Sky, MT, USA

1. Introduction

Although commercial reliability standards are required by all high temperature electronic components, not many studies of high temperature reliability have been documented in periodicals or journals. The High Temperature Electronic Conferences have been the main forums for such publications [1]–[11]. Previous studies have concentrated on interconnections [1], reliability modeling [2], [5], metallization studies [4], [6], passive components [11], and high temperature reliability studies of active devices [3], [7], [8], [9], [10].

References

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