I. Introduction
The predominant Si-based MOSFET is facing fundamental limitations due to drain induced barrier lowering (DIBL), quantum tunneling of carriers from source to drain and excessive power dissipation due to lowest possible SS of 60 mV/decade [1]. To overcome these issues, several improvements in architecture have been proposed [2]–[5]. Though tunnel field-effect transistor (TFET) and negative capacitance FET (NCFET), to some extent, have addressed the low-power density problem and demonstrated low sub- threshold slope, its low on current and poor electrostatic control over the channel region remains an unsolved issue [6], [7]. Among the newly emerged two dimensional (2D) materials, graphene and phosphorene are not suitable for logic operation due to zero bandgap and instability in normal atmospheric conditions [8]–[10]. Transition metal dichalcogenide (TMDC) materials with their decent bandgap, higher effective mass in the direction of propagation, good carrier mobility, and thermal stability become an ideal candidate for the transistor technology [11]. Among the TMDC materials, monolayer MoS2 is a direct bandgap (1.8 eV) material with a lattice constant of 3.16 Å and has a bond angle of 80.73° between molybdenum and sulfur atoms in its composition [12], [13].