I. Introduction
With the fast development of wireless technology, research on millimeter-wave technology for 5G applications has become popular [1], [2]. To meet the high data transmission rate requirements for 5G communication systems, a millimeter-wave communication system should have the ability to realize beam forming and scanning [3]. Therefore, millimeter-wave phased array systems are considered as the next-generation communication systems. Due to its multiple channels, a phased array system requires low direct current power consumption, low production cost and high integration density for each channel [4]. Benefiting from the continued scaling of deep-submicron CMOS technology, the integration density of silicon-based circuits is increased, the circuit power consumption is reduced and the cut-off frequency () is increased [5]. Thus, this technology has emerged as a competitor to the gallium arsenide (GaAs) process for microwave front-end applications.