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A 37–40-GHz Low-Phase-Imbalance CMOS Attenuator With Tail-Capacitor Compensation Technique | IEEE Journals & Magazine | IEEE Xplore

A 37–40-GHz Low-Phase-Imbalance CMOS Attenuator With Tail-Capacitor Compensation Technique


Abstract:

A Ka-band 5-bit CMOS digital step attenuator (DSA) with low phase variations for 5G applications is presented. The attenuator cell is optimized to alleviate the phase var...Show More

Abstract:

A Ka-band 5-bit CMOS digital step attenuator (DSA) with low phase variations for 5G applications is presented. The attenuator cell is optimized to alleviate the phase variations of conventional switched attenuators. A tail capacitor that is connected in series with the shunt resistor is used to construct a correction network with hyperbolic function characteristics. The DSA was implemented using a 65 nm CMOS process. It has a maximum attenuation range of 31 dB with 1.0 dB steps. With the help of the tail capacitor, the DSA exhibits a root-mean-square (rms) amplitude error less than 0.27 dB and a rms phase error less than 3.7° from 37–40 GHz, the lowest such errors ever reported. The active core layout area is 0.22 mm2 (0.51 mm \times \,\, 0.42 mm). It shows suitable performance for 5G applications. The DSA is integrated into a phase-/amplitude-controlling chip to constitute a 5G system.
Page(s): 3400 - 3409
Date of Publication: 21 May 2020

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I. Introduction

With the fast development of wireless technology, research on millimeter-wave technology for 5G applications has become popular [1], [2]. To meet the high data transmission rate requirements for 5G communication systems, a millimeter-wave communication system should have the ability to realize beam forming and scanning [3]. Therefore, millimeter-wave phased array systems are considered as the next-generation communication systems. Due to its multiple channels, a phased array system requires low direct current power consumption, low production cost and high integration density for each channel [4]. Benefiting from the continued scaling of deep-submicron CMOS technology, the integration density of silicon-based circuits is increased, the circuit power consumption is reduced and the cut-off frequency () is increased [5]. Thus, this technology has emerged as a competitor to the gallium arsenide (GaAs) process for microwave front-end applications.

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