Simulation of temperature profiles in reflow ovens for soldering area array components | IEEE Conference Publication | IEEE Xplore

Simulation of temperature profiles in reflow ovens for soldering area array components


Abstract:

This paper presents computational fluid dynamics (CFD) simulations in the field of electronics manufacturing technology of area array components, namely a BGA, where the ...Show More

Abstract:

This paper presents computational fluid dynamics (CFD) simulations in the field of electronics manufacturing technology of area array components, namely a BGA, where the calculation of temperatures within the solder joint during a reflow soldering process are focused on. The CFD models were generated in the ANSYS Workbench and compute the flow field for the air, solder and solid structures such that the interaction between the air and solder are captured. The CFD models yielded the temporal progression of the temperature field and were furthermore capable of capturing the melting and solidification of the solder. The influence of the latent heat of the solder as a material property, enabled by the melting/solidification model, was studied in order to quantify its influence and, secondly, to verify that the latent heat was having the intended influence on the CFD model.
Date of Conference: 16-19 September 2019
Date Added to IEEE Xplore: 09 January 2020
ISBN Information:
Conference Location: Pisa, Italy

Introduction

Soldering failures in reflow ovens can of ten be attributed to inhomogeneous temperature distributions, owing to poor compatibility between the materials used [1], which are often difficult to anticipate with the fostering and influence of intermetallic compounds being difficult to determine [1], [2].

References

References is not available for this document.