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Enhanced IC Modeling Methodology for System-level ESD Simulation | IEEE Conference Publication | IEEE Xplore

Enhanced IC Modeling Methodology for System-level ESD Simulation


Abstract:

To enable accurate system-level ESD simulation, the quasi-static I-V model of an IC is enhanced through kernel regression to reflect its circuit board dependency; alterna...Show More

Abstract:

To enable accurate system-level ESD simulation, the quasi-static I-V model of an IC is enhanced through kernel regression to reflect its circuit board dependency; alternatively, a recurrent neural network may be used to generate a non-quasi-static transient model. Hybrid electromagnetic and circuit simulation is demonstrated for ESD-induced noise coupling analysis.
Date of Conference: 23-28 September 2018
Date Added to IEEE Xplore: 28 October 2018
ISBN Information:
Print on Demand(PoD) ISSN: 0739-5159
Conference Location: Reno, NV, USA

I. Introduction

The Industry Council on ESD Target Levels advocates using SPICE-like circuit simulation to evaluate system-level ESD reliability, rather than first identifying problems at the time of product qualification testing [1]. This paradigm was named system efficient ESD design, or SEED. From the description of SEED provided in [1], circuit simulation is used to obtain the current and voltage waveforms at the “external pins” of any components that lie on the discharge path. One-port models that have been optimized for high-current ESD-like conditions are used to represent those external pins, and the reference terminal is connected to the system ground.

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References

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