I. Introduction
Surface micromachining technology [1], [2] has been used to fabricate microelectromechanical systems (MEMS), such as micro accelerometers [3], [4] and micromirrors [5]–[8], for decades due to its simplicity, maturity, low cost and high compatibility with CMOS process. In the last step of the surface micromachining process, the MEMS device is normally wet released, at which point the free-standing structure, especially if it is large size (i.e. 100s to 1 mm) structure, could easily stick to the substrate due to the capillary effect and electrostatic and chemical forces [9]–[11]. This is called stiction, and it is a fundamental problem with surface micromachining processes, as it causes low yield.