I. Introduction
Disruption and damage from an electrostatic discharge (ESD) can be observed even if the discharge does not directly go into a sensitive trace. An ESD may also cause a secondary ESD event within a product. An example of a secondary ESD is sparking between decorative metal and the grounded housing of a system. Being a function of the capacitance between the decorative metal and the grounded enclosure, the secondary spark currents can reach as high as 600 A—five times higher than that of the primary ESD [1]– [3]; the rise time of this current can be on the order of only a few hundred picoseconds. Two factors contribute to the higher currents and faster rise times. The charged capacitance between the ungrounded metal and the grounded structures forms a low impedance source for the secondary spark. Second, the spark gap is usually a highly overvoltage effect, i.e., the fast charging of the gap by the primary ESD allows the voltage across the secondary gap to reach voltages higher than the static breakdown voltage. So, once the breakdown is initiated, the voltage collapse time will be much shorter than the voltage collapse time of the static breakdown case. Both effects lead to high peak currents associated with sub-nanosecond rise times.