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PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors | IEEE Journals & Magazine | IEEE Xplore

PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors


Abstract:

The power distribution network (PDN) of a high-speed printed circuit board requires a high-performance power supply. The total equivalent inductance above the top ground ...Show More

Abstract:

The power distribution network (PDN) of a high-speed printed circuit board requires a high-performance power supply. The total equivalent inductance above the top ground plane is an important part of PDN design and is regarded as Labove. In this paper, an inductance library for different structures of capacitor connections and capacitor sizes has been built, which is essential for PDN design. computer simulation technology (CST) and partial element equivalent circuit method are applied to obtain the shorted pattern design curves at various design data. The shorted pattern design curve means the total equivalent inductance varies with the distance between pad and ground plane. In addition, an approximate shorted model is established for a decoupling capacitor-mounted model, which will be convenient for us to get the inductance of Labove. In this paper, the design curve provides an intuitive guideline in designing PDN and facilitates the industry to choose what they want with consideration of the inductance, space, via numbers, etc.
Published in: IEEE Transactions on Electromagnetic Compatibility ( Volume: 60, Issue: 6, December 2018)
Page(s): 1898 - 1906
Date of Publication: 15 November 2017

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Funding Agency:

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I. Introduction

POWER  integrity is important for high-speed printed circuit boards (PCBs) in the field of electromagnetic compatibility [1]. It considers whether the desired voltage and current have met the design requirements from sources to destinations. Reduction in voltage across the power supply terminals of the IC slows down the transistor or prevents the transistors from switching states; whereas, increases in voltage across the power supply terminals of the IC creates reliability problems. The impedance looking from the voltage regulator module (VRM) to IC part should meet the target impedance to ensure the dc ripple is not too large to effect the switching of the transistors. Therefore, it is essential to design a power distribution network (PDN) to meet the target impedance.

Cites in Papers - |

Cites in Papers - IEEE (16)

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1.
Xiaoyuan Song, Boyu Zheng, Jiahu Luo, Ping Wei, Lei Liu, "Effect of Decoupling Capacitor Location on PDN Impedance in fcBGA Packages", 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), pp.360-363, 2024.
2.
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3.
Yifan Ding, Shuang Liang, Francesco De Paulis, Matteo Cocchini, Samuel Connor, Matthew Doyle, Albert Ruehli, Chulsoon Hwang, James Drewniak, "System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors", 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.249-254, 2023.
4.
Dong Xiao, Xiao-jing Li, Yun Li, Huipin Lin, Jiaxin Qian, Chao Hu, "The Screening Method of Board-Level Decoupling Capacitors for Multi-Power Distribution Network", 2023 42nd Chinese Control Conference (CCC), pp.7111-7116, 2023.
5.
Fabrizio Loreto, Daniele Romano, Martin Štumpf, Albert E. Ruehli, Giulio Antonini, "Time-Domain Computation of Full-Wave Partial Inductances Based on the Modified Numerical Inversion of Laplace Transform Method", IEEE Transactions on Signal and Power Integrity, vol.1, pp.32-42, 2022.
6.
Rassul Bairamkulov, Abinash Roy, Mahalingam Nagarajan, Vaishnav Srinivas, Eby G. Friedman, "SPROUT—Smart Power Routing Tool for Board-Level Exploration and Prototyping", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.41, no.7, pp.2263-2275, 2022.
7.
Rassul Bairamkulov, Abinash Roy, Mali Nagarajan, Vaishnav Srinivas, Eby G. Friedman, "SPROUT - Smart Power ROUting Tool for Board-Level Exploration and Prototyping", 2021 58th ACM/IEEE Design Automation Conference (DAC), pp.283-288, 2021.
8.
Shuang Liang, Biyao Zhao, Siqi Bai, Samuel Connor, Matteo Cocchini, Stephen Scearce, Dale Becker, Michael Cracraft, Matthew S Doyle, Albert Ruehli, James Drewniak, "Decoupling Capacitor Optimization to Achieve Target Impedance in PCB PDN Design", 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.967-972, 2021.
9.
Federico Sordi, Lorenzo Capineri, Carlo Carobbi, "Lumped Circuit Model and VNA Measurement of the RF Impedance of a Bypass Network", 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.196-201, 2021.
10.
Milad Mehri, "Stochastic Analysis Method for Tree-Type PDNs on Mixed-Signal PCB", 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), pp.1-4, 2021.
11.
Biyao Zhao, Siqi Bai, Samuel Connor, Stephen Scearce, Matteo Cocchini, Brice Achkir, Albert Ruehli, Bruce Archambeault, Jun Fan, James Drewniak, "Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN", IEEE Electromagnetic Compatibility Magazine, vol.9, no.4, pp.80-90, 2020.
12.
Biyao Zhao, Shuang Liang, Samuel Connor, Matteo Cocchini, Brice Achkir, Albert Ruehli, Bruce Archambeault, Jun Fan, James Drewniak, "Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs", IEEE Electromagnetic Compatibility Magazine, vol.9, no.3, pp.84-94, 2020.
13.
Yin Sun, Songping Wu, Jianmin Zhang, Chulsoon Hwang, Zhiping Yang, "Decoupling Capacitor Layout Design Guidelines for Acoustic Noise Consideration in Power Distribution Network", 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp.357-362, 2020.
14.
Yifan Ding, Biyao Zhao, Shuang Liang, Siqi Bai, Samuel Connor, Matteo Cocchini, Brice Achkir, Stephen Scearce, Erping Li, B. Archambeault, Jun Fan, James Drewniak, "Equivalent Inductance Analysis and Quantification for PCB PDN Design", 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), pp.366-371, 2019.
15.
Colin Andrew Pardue, Hakki Mert Torun, Mohamed Lamine Fayçal Bellaredj, Madhavan Swaminathan, "RF Near-Field Coupling System Using Reverse PDN and Considering Electromagnetic Effects", IEEE Transactions on Electromagnetic Compatibility, vol.61, no.6, pp.1904-1912, 2019.
16.
Petr Kadlec, Martin Marek, Martin Štumpf, Vladimír Šeděnka, "PCB Decoupling Optimization With Variable Number of Capacitors", IEEE Transactions on Electromagnetic Compatibility, vol.61, no.6, pp.1841-1848, 2019.

Cites in Papers - Other Publishers (3)

1.
Rassul Bairamkulov, Eby Friedman, "SPROUT - Smart Power ROUting Tool for board-level exploration and prototyping", Graphs in VLSI, pp.257, 2023.
2.
Milad Mehri, "A circuit level analysis of power distribution network on a PCB layout exposed to intentional/unintentional electromagnetic threats", Integration, vol.89, pp.25, 2023.
3.
de Paulis, Cecchetti, Olivieri, Piersanti, Orlandi, Buecker, "Efficient Iterative Process based on an Improved Genetic Algorithm for Decoupling Capacitor Placement at Board Level", Electronics, vol.8, no.11, pp.1219, 2019.
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