Zheyao Wang (M’07–SM’13) was born in China, in 1972. He received the B.S. degree in mechanical engineering and the Ph.D. degree in mechatronics from Tsinghua University, Beijing, China, in 1995 and 2000, respectively. From 2000 to 2002, he was a Post-Doctoral Research Fellow with the Institute of Microelectronics, Tsinghua University, where he was worked on silicon micromachining for microsensor applications. In 2002, he joined DIMES, Delft University of Technology, Delft, The Netherlands, as a Post-Doctoral Researcher, and worked on silicon micromachined components for 3-D packaging. He is currently a Full Professor with Tsinghua University. His research interests include microsensors, 3-D integration, and MEMS.
He has authored or co-authored two books and more than 120 peer-reviewed journal and conference paper, and filed 18 patents. He has been a Technical Program Committee Member for the IEEE Sensors Conference since 2008, the China Semiconductor Technology International Conference since 2011, and Transducers 2017. He also served as the Organization Committee Member for the IEEE Micro/Nano Engineered in 2013, 2014, and 2017, the Molecular Systems Conference, the 2012 Sixth Asia–Pacific Conference on Transducers and Micro/Nano Technologies, and the 2011 Electrical Design of Advanced Packaging and Systems.
Zheyao Wang (M’07–SM’13) was born in China, in 1972. He received the B.S. degree in mechanical engineering and the Ph.D. degree in mechatronics from Tsinghua University, Beijing, China, in 1995 and 2000, respectively. From 2000 to 2002, he was a Post-Doctoral Research Fellow with the Institute of Microelectronics, Tsinghua University, where he was worked on silicon micromachining for microsensor applications. In 2002, he joined DIMES, Delft University of Technology, Delft, The Netherlands, as a Post-Doctoral Researcher, and worked on silicon micromachined components for 3-D packaging. He is currently a Full Professor with Tsinghua University. His research interests include microsensors, 3-D integration, and MEMS.
He has authored or co-authored two books and more than 120 peer-reviewed journal and conference paper, and filed 18 patents. He has been a Technical Program Committee Member for the IEEE Sensors Conference since 2008, the China Semiconductor Technology International Conference since 2011, and Transducers 2017. He also served as the Organization Committee Member for the IEEE Micro/Nano Engineered in 2013, 2014, and 2017, the Molecular Systems Conference, the 2012 Sixth Asia–Pacific Conference on Transducers and Micro/Nano Technologies, and the 2011 Electrical Design of Advanced Packaging and Systems.View more 
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