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Determination of Equivalent Coupling Surface of Passive Components Using the TEM Cell | IEEE Journals & Magazine | IEEE Xplore

Determination of Equivalent Coupling Surface of Passive Components Using the TEM Cell


Abstract:

The design of cheaper and more compact electromagnetic compatibility (EMC) filters can be achieved by exploiting the magnetic coupling between components. This requires t...Show More

Abstract:

The design of cheaper and more compact electromagnetic compatibility (EMC) filters can be achieved by exploiting the magnetic coupling between components. This requires the knowledge of coupling coefficients between components and, consequently, of their equivalent coupling surface. The aim of this paper is to present how this coupling surface can be determined using a transverse electromagnetic mode cell. This methodology is described and applied to two different cases: a capacitor and an inductor. In order to validate the determination and usage of equivalent coupling surfaces, a comparison between the calculation and measurement of mutual inductances is carried out on practical examples.
Published in: IEEE Transactions on Electromagnetic Compatibility ( Volume: 60, Issue: 2, April 2018)
Page(s): 298 - 309
Date of Publication: 06 July 2017

ISSN Information:

Citations are not available for this document.

I. Introduction

In Filter design, intercomponent coupling plays a major role in the filter response. It was demonstrated in [1] and [2] that the magnetic coupling between the components has to be taken into account to have a good prediction of the filter attenuation. Furthermore, in [3], it was shown that the filter attenuation highly depends on the position of the components and, therefore, on the magnetic coupling between the components. For the purpose of calculating the coupling coefficient, the principle presented in [4] is used.

Cites in Papers - |

Cites in Papers - IEEE (12)

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1.
Tito Yuwono, Mohd Hafiz Baharuddin, Norbahiah Misran, Mahamod Ismail, David W. P. Thomas, Christopher Smartt, Hristo Zhivomirov, "Automatic Segmentation of Nonstationary EM Emission of Electronics Product", IEEE Access, vol.10, pp.40456-40466, 2022.
2.
Kevin Loudiere, Frédéric Lafon, Priscila Fernandez-Lopez, Marine Stojanovic, Jean-François Léon, "EMC Methodology to Optimize Application of Electronic Component Multisourcing", 2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), pp.139-144, 2022.
3.
Marine Stojanovic, Frédéric Lafon, Priscila Fernandez-Lopez, Kevin Loudiere, Catalina Vasquez-Hormazabal, "Determination of Equivalent Coupling Surface of Ferrite Beads and related Filter Design Stakes for Multi-Sourcing", 2021 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), pp.54-58, 2022.
4.
Xuecheng Xu, Xiangjun Lu, Xie An, "Research on Electromagnetic Interference of Integrated Circuit for Intelligent Electronic Lock", 2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM), pp.35-42, 2020.
5.
Ruijie He, Yang Xu, Sameer Walunj, Shaohui Yong, Victor Khilkevich, David Pommerenke, Hermann L. Aichele, Martin Boettcher, Philipp Hillenbrand, Andreas Klaedtke, "Modeling Strategy for EMI Filters", IEEE Transactions on Electromagnetic Compatibility, vol.62, no.4, pp.1572-1581, 2020.
6.
Mohsen Koohestani, Richard Perdriau, Mohamed Ramdani, "An Effective Approach to Mitigate IC Radiated Susceptibility in EM Far-Field Region", 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, pp.144-148, 2019.
7.
Mohsen Koohestani, Richard Perdriau, Mohamed Ramdani, "Influence of Dielectric Permittivity on Radiated Immunity in Real and Emulated Far-Fields", 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, pp.31-35, 2019.
8.
Ruijie He, Sameer Arun Walunj, Shaohui Yong, Victor Khilkevich, David Pommerenke, Hermann Aichele, Martin Boettcher, Philipp Hillenbrand, Andreas Klaedtke, "Modelling Strategy for Film Capacitors in EMI Filters", 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), pp.259-265, 2019.
9.
Mohsen Koohestani, Richard Perdriau, Jean-Luc Levant, Mohamed Ramdani, "A Novel Passive Cost-Effective Technique to Improve Radiated Immunity on PCBs", IEEE Transactions on Electromagnetic Compatibility, vol.61, no.6, pp.1733-1739, 2019.
10.
Marine Stojanovic, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani, "Accurate Analytical Prediction of EMI Filter Attenuation by Considering Intercomponent Coupling Phenomena", IEEE Transactions on Electromagnetic Compatibility, vol.61, no.4, pp.1042-1051, 2019.
11.
Haiwei Zhang, Aiguo Wu, "Common-Mode Noise Reduction by Parasitic Capacitance Cancellation in the Three-Phase Inverter", IEEE Transactions on Electromagnetic Compatibility, vol.61, no.1, pp.295-300, 2019.
12.
Marine Stojanovic, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani, "Determination of the coupling model of common mode chokes using a TEM cell", 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, pp.1-6, 2017.

Cites in Papers - Other Publishers (1)

1.
Christian Riener, Thomas Bauernfeind, Paul Baumgartner, Herbert Hackl, Martin Ibel, Samuel Kvasnicka, Ralph Prestros, Klaus Roppert, Manfred Kaltenbacher, " 3D modeling of inductive and capacitive coupling between surface‐mounted multilayer‐capacitors ", International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2022.
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References

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