1. Introduction
With the development of high power microwave (HPM) technology, the effect of all kinds of external electromagnetic interference signals on electronic devices is increasingly concerned by researchers [1]–[3]. Ref. [2] assumes that the GaAs field effect tube in the HPM electromagnetic interference generated heat distribution area, in the followed work also studied on the transverse expansion bulk MOSFET in under the action of HPM breakdown phenomenon. The effect of MOSFET leakage current on the performance of the HPM signal was calculated by using the semiconductor simulation software ISE-TCAD in Ref. [3]. All in all, it is helpful to a better understanding of physical image and action mechanism of electronic systems against HPM, analyze the causes and mechanisms of HPM failure. As an important and basic protection component, failure or not of the ESD devices has an important influence on the regular work of electronic devices. Therefore, research on the HPM effect of ESD devices, is able to get a far better understanding on how to interfere with the electronic system, as well as provide technical reference for the protection and reinforcement of HPM.