Transmission performance of bonding wire at high frequency

Bonding wire is used to make an interconnection between ICs and the PCB board. It is small but critical in the structure. In this paper, educational 3D electromagnetic analysis software CST MWS was used to model and simulate several bonding wires with different parameters at high frequency. This paper focuses on relations between parameter changes and transmission performance of bonding wires, forming a good guide for the package design.

I. Introduction

With the increasing speed of data transmission and system working frequency, there comes higher requirement to the interconnections in EMI and signal integrity level. As bonding wire is becoming an important connection in IC packaging, its transmission performance is affecting the signal integrity of the whole packaging. So, research on the transmission performance of bonding wires in integrated circuits has become an important and a hot topic.