I. Introduction
The ever-increasing demands in the energy conversion market propel power converters toward high efficiency and high power density. High-performance power semiconductor devices are indispensable to address higher efficiency and density requirements. Newly emerged wide-bandgap (WBG) semiconductor devices, such as silicon carbide (SiC) and gallium nitride (GaN) devices, provide desirable features of low specific on-state resistance, low junction capacitance, and increased junction temperature. They are promising candidates for the future high-efficiency and high-density power converters [1], [2].