I. Introduction
Electronic devices and systems compatible with flexible electronics applications have received more attention in recent years. The major goal of this technology is to develop flexible, bendable or stretchable devices, and systems for applications, such as displays [1], sensors [2], logic circuit components [3], and memories [4]. To achieve these goals, different materials and fabrication processes have to be developed to be compatible with the low temperature substrates. Both organic and inorganic materials have been utilized to fabricate devices [5]–[7]. Devices fabricated with hybrid materials (organic and inorganic materials) have also been demonstrated to achieve better performance [8], [9].