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TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs | IEEE Journals & Magazine | IEEE Xplore

TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs


Abstract:

3-D integrated circuits (3-D ICs) are expected to have shorter wirelength, better performance, and less power consumption than 2-D ICs. These benefits come from die stack...Show More

Abstract:

3-D integrated circuits (3-D ICs) are expected to have shorter wirelength, better performance, and less power consumption than 2-D ICs. These benefits come from die stacking and use of through-silicon vias (TSVs) fabricated for interconnections across dies. However, the use of TSVs has several negative impacts such as area and capacitance overhead. To predict the quality of 3-D ICs more accurately, TSV-aware 3-D wirelength distribution models considering the negative impacts were developed. In this paper, we apply an optimal buffer insertion algorithm to the TSV-aware 3-D wirelength distribution models and present various prediction results on wirelength, delay, and power consumption of 3-D ICs. We also apply the framework to 2-D and 3-D ICs built with various combinations of process and TSV technologies and predict the quality of today and future 3-D ICs.
Page(s): 1384 - 1395
Date of Publication: 18 August 2014

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I. Introduction

Three-dimensional integrated circuits (3-D ICs) have new design parameters such as die-to-die bonding styles, through-silicon-via (TSV) types, TSV size, and the die count to be stacked. Therefore, 3-D ICs have much larger design space than traditional 2-D integrated circuits (2-D ICs), so the need for fast estimation of the quality (area, delay, power, etc.) of 3-D ICs is increasing for early design space exploration. Among various quality estimation methodologies such as system-level modeling and fast prototyping for early-stage design space exploration, using wirelength distribution models is widely and frequently used because the models are simple, fast, sufficiently accurate, and easy to use.

References

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