Advanced modeling and design of substrate integrated waveguide components

This paper presents some recent advances in the electromagnetic modeling and design of substrate integrated waveguide (SIW) components. The modeling of losses in SIW structures is discussed in details, and a new formula for the calculation of the attenuation constant due to radiation loss is introduced. In addition, an efficient technique for the modeling of arbitrarily shaped SIW components is discussed: this technique is based on the Boundary Integral-Resonant Mode Expansion (BI-RME) method. The BI-RME method permits the direct derivation of parametric and multimodal equivalent circuit models of SIW discontinuities, which can be adopted in the fast design of SIW components and systems.

I. Introduction

Substrate Integrated Waveguide (SIW) technology is gaining increasing popularity for the implementation of microwave and mm-wave circuits and antennas [1]. SIW structures are integrated rectangular waveguide structures, realized by using two rows of metal vias or slots in a dielectric substrate with top and bottom metal planes (Fig. 1). Due to the large design flexibility, SIW technology allows to realize complex circuits and complete systems on a single dielectric substrate, according to the so-called Systems on Substrate (SoS) approach [2].