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High performance travelling wave Mach-Zehnder modulators for emerging generations of high capacity transmitter components | IEEE Conference Publication | IEEE Xplore

High performance travelling wave Mach-Zehnder modulators for emerging generations of high capacity transmitter components


Abstract:

High speed InP-based travelling wave electrode (TWE) Mach-Zehnder modulators are presented and their integration capabilities to fabricate next generations of compact and...Show More

Abstract:

High speed InP-based travelling wave electrode (TWE) Mach-Zehnder modulators are presented and their integration capabilities to fabricate next generations of compact and high capacity transmitter components by utilizing so-called “monolithic-on-hybrid” integration approaches are emphasized.
Date of Conference: 23-27 June 2013
Date Added to IEEE Xplore: 19 September 2013
Electronic ISBN:978-1-4799-0683-3

ISSN Information:

Conference Location: Cartagena, Spain

1. INTRODUCTION

Continues increase of data traffic due to emerging new and advanced multi-media services - like video streaming, HD TV, 3-dim TV, cloud computing, real time gaming - calls for ongoing improvement and update of optical communication networks. Thus WDM technologies utilizing advanced and spectrally efficient multilevel modulation formats (e.g. Pol-D(Q)PSK, QAM, OFDM) in combination with coherent detection schemes currently attract much attention regarding the development of flexible and economic high capacity optical transmission systems. These techniques offer more bits/symbol to be transmitted, i.e. higher overall bitrates become achievable without a commensurate increase in signal bandwidth of each single active sub-element. As a consequence, increasing component complexity - and thus overall footprint - has to be considered. Obviously, the fabrication of compact transmitter, receiver and transceiver devices intended for volume deployment is a challenging task for device manufacturers. In particular, to provide high performance components while simultaneously enabling economic device fabrication across all given specifications is a big challenge. Different specifications have to be met independently, e.g. on e/o bandwidth, driving voltage, optical insertion loss, power consumption, reproducibility, reliability, device yield, and integration.

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References

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