I. Introduction
The atmospheric absorption factor and abundantly available spectrum resources have made the 60-GHz band attractive for short-range and high-speed wireless communications [1]. The recent advances in CMOS have enabled single-chip solutions of 60-GHz radios, paving the way for the 60-GHz band being explored for commercial applications [2], [3]. For the 60-GHz market to flourish, however, cheap antennas are required, not only low-cost IC chipsets [4]–[8]. Also, high-gain antennas are needed, due to low transmit power (10 mW), large propagation loss (68 dB at 1 m), and high data rate Gbps [9]. Planar array antennas on standard low temperature co-fired ceramic (LTCC) and printed circuit board (PCB) processes are found suitable for 60-GHz integrated radios for their high gain and low profile. For example, a patch array antenna [10] fed by a T-junction network on an LTCC substrate achieved the maximum gain of 14.1 dBi with 4×4 radiating elements at 61 GHz and a slot array antenna [11] based on the substrate integrated waveguide in a PCB substrate attained the maximum gain of 22 dBi with 12×12 radiating elements at 60.5 GHz.