Fine thickness control of amorphous silicon by wet-etching for low loss wire waveguide | IEEE Conference Publication | IEEE Xplore

Fine thickness control of amorphous silicon by wet-etching for low loss wire waveguide


Abstract:

Isotropic wet-etching without surface roughening was applied to an a-Si:H film with nanometer-scale thickness controllability. Record ~1.2 dB/cm low propagation loss was ...Show More

Abstract:

Isotropic wet-etching without surface roughening was applied to an a-Si:H film with nanometer-scale thickness controllability. Record ~1.2 dB/cm low propagation loss was obtained in an etched wire waveguide, being comparable to those of SOI waveguides.
Date of Conference: 14-16 September 2011
Date Added to IEEE Xplore: 31 October 2011
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ISSN Information:

Conference Location: London, UK

I. Introduction

By partly replacing metallic wirings of the inter/inner-chips in LSIs by optical waveguides, speed-up of signal transmission and energy-saving are expected. In particular, waveguides using hydrogenated amorphous silicon (a-Si:H) materials are promising, because a-Si:H can have small material absorption loss in near-infrared by growth under proper conditions and can be formed at low temperatures enabling the device fabrication on the electric circuit layers. In addition, a-Si:H waveguides have an attractive promise of 3-D wiring possibility. So far, several groups have reported the fabrication ability of high quality wire waveguides with a-Si:H material [1]–[3].

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