I. Introduction
Phase-Change random access memory (PCRAM) is widely considered as one of the most promising candidates for the next-generation nonvolatile memory because of its excellent characteristics [1]–[6]. Although PCRAM has been commercialized in certain application fields at present, there are still some problems needed to be solved. First, for large-scale commercial applications, low power consumption is one of the most important issues. In addition, the volume change of the most commonly used phase-change material (GST) during the operation process is relatively large, which will lead to unreliable contact between the phase-change material and the heating electrode, thus deteriorating the reliability of the PCRAM device [7]. In order to improve the performance of the PCRAM, many efforts, including optimization of GST and device structure, have been carried out in the past years [8]–[10]. Furthermore, screening a proper new phase-change material is also an effective way to overcome the obstacles in the current PCRAM technology.