Monolithic flip-chip compatible twin-IQ Mach-Zehnder modulators for hybrid assembly onto high capacity optical transmitter boards | IEEE Conference Publication | IEEE Xplore

Monolithic flip-chip compatible twin-IQ Mach-Zehnder modulators for hybrid assembly onto high capacity optical transmitter boards


Abstract:

This paper reports on the first development, fabrication, and characterization of monolithic InP-based twin-IQ Mach-Zehnder modulator chips as basic building blocks for f...Show More

Abstract:

This paper reports on the first development, fabrication, and characterization of monolithic InP-based twin-IQ Mach-Zehnder modulator chips as basic building blocks for future high capacity and large scale planar optical Silica-on-Si transmitter boards. The monolithic devices are designed for hybrid assembly by utilizing passive chip alignment techniques in combination with flip-chip bonding technology. Electrical GSG and GS transmission lines have been integrated and connected on InP-based modulator chips for the first time. Very compact and low loss twin-IQ modulators have been demonstrated. Small signal response measurements taken on chip level reveal an overall data chip capacity of 100 Gb/s.
Date of Conference: 22-26 May 2011
Date Added to IEEE Xplore: 08 August 2011
ISBN Information:
Print ISSN: 1092-8669
Conference Location: Berlin, Germany
Citations are not available for this document.

1 Introduction

Further ongoing rapid growth of internet and multi-media data transfer worldwide requires economic and high capacity (≥ 1 Tb/s) optical transmission networks in future. For this purpose, different WDM technologies utilizing advanced, spectrally efficient modulation and detection formats are currently in the focus of network designers and system vendors (e.g., D(Q)PSK, PolMux DQPSK, multilevel x-QAM). The success of such transmission networks will strongly rely on the availability of compact, high performance, reliable, and low cost device modules as basic active or passive network building blocks (e.g. transmitters, receivers, routers). Low power consumption is another important issue which has to be considered as well. In order to meet predetermined system specifications and requirements, the use and combination of monolithic and hybrid integration technologies represent a promising approach for commercial component fabrication (“monolith-ic-on-hybrid” technique, [1]). Obviously, both have their own pros and cons because there is no single material system and technology available so far which meets all existing demands for practical device and network applications. But the “monolithic-on-hybrid” technique has the potential to benefit from the advantages of both approaches. However, these have been improved considerably in the last two years and moved already from research status towards commercial application.

Cites in Papers - |

Cites in Papers - IEEE (3)

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1.
Hideki Yagi, Takamitsu Kitamura, Naoya Kono, Hirohiko Kobayashi, Naoko Inoue, Kazuhiko Horino, Daisuke Kimura, Kosuke Fujii, Yoshihiro Yoneda, Chie Fukuda, Hajime Shoji, "Low driving voltage InP-based Mach-Zehnder modulators for compact 128 Gb/s DP-QPSK module", 2013 Conference on Lasers and Electro-Optics Pacific Rim (CLEOPR), pp.1-2, 2013.
2.
R. Kaiser, B. Gomez Saavedra, K.O. Velthaus, M. Gruner, M. Hamacher, D. Hoffmann, M. Schell, "High performance travelling wave Mach-Zehnder modulators for emerging generations of high capacity transmitter components", 2013 15th International Conference on Transparent Optical Networks (ICTON), pp.1-4, 2013.
3.
R. Kaiser, K. O. Velthaus, T. Brast, M. Gruner, M. Hamacher, D. Hoffmann, M. Schell, "Medium and large scale Mach-Zehnder modulator ICs on InP for fabrication of advanced transmitters", 2012 14th International Conference on Transparent Optical Networks (ICTON), pp.1-4, 2012.

Cites in Papers - Other Publishers (1)

1.
Naoya Kono, Takamitsu Kitamura, Hideki Yagi, Naoki Itabashi, Taizo Tatsumi, Yasuyuki Yamauchi, Kosuke Fujii, Kazuhiko Horino, Shingo Yamanaka, Keiji Tanaka, Kazuhiro Yamaji, Chie Fukuda, Hajime Shoji, "Compact and low power DP-QPSK modulator module with InP-based modulator and driver ICs", 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), pp.1-3, 2013.
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