Review of Packaging of Optoelectronic, Photonic, and MEMS Components

Packaging is a core technology to leverage the functions and the performances of micro- and nano-structures in a system. In order to bring them to application, the gap between component and environment has to be bridged by providing reliable interfaces. This paper reviews the packaging of optoelectronic, photonic, and microelectromechanical systems (MEMS) components. State-of-the-art requirements, standard technologies, and approaches are considered. Recent trends and research results in the packaging of advanced photonic, MEMS, Si-photonic components, and in 3-D, heterogeneous integration, and SiP are discussed.

I. Introduction

Bridging the gap between the micro- or nano-structures and the applications by means of providing reliable interfaces would not be assured without integration and packaging technologies. Today's photonics covers a diverse and wide range of application fields [1]: 1)

information and communication;

2)

industrial production/manufacturing and quality;

3)

life sciences and health;

4)

lighting and displays;

5)

security, metrology and sensors;

6)

design and manufacturing of components and systems.