I. Introduction
Nowadays, CMOS image sensors based on active pixel sensors (APS) are considered the preferred technology for most imaging applications [1]. This success of CMOS imagers is owed in part to some of their intrinsic advantages compared to charge-coupled devices (CCD) such as x-y pixel addressing, in pixel amplification, and signal processing. Recently, these characteristics have also enabled a number of developments in the field of 3D Time-of-Flight (ToF) and low-light level imaging [2–8]. However, the use of high doping profiles, thin gate oxides, and low power supply voltages, necessary in modern sub-micron CMOS technologies, still adversely affects the performance of many analog circuits and photodetectors. This proves to be especially challenging for high speed imaging applications like 3D imaging which require large-area, low dark current, and low noise [2]. Taking into account these intrinsic constraints of CMOS technology a new, fast detector concept has been developed.