High-Inductance-Density, Air-Core, Power Inductors, and Transformers Designed for Operation at 100–500 MHz | IEEE Journals & Magazine | IEEE Xplore

High-Inductance-Density, Air-Core, Power Inductors, and Transformers Designed for Operation at 100–500 MHz


Abstract:

This paper presents the microfabrication and measurement of high-inductance-density, moderate-Q, air-core inductors, and transformers intended for switch-mode power suppl...Show More

Abstract:

This paper presents the microfabrication and measurement of high-inductance-density, moderate-Q, air-core inductors, and transformers intended for switch-mode power supplies operating in the 100-500 MHz frequency range. The inductors and transformers were fabricated on Pyrex substrates with four layers of electrodeposited copper with each layer up to 10 ¿m thick. Stacked winding layers allowed for mutual coupling between layers to increase areal inductance density. Inductors of various designs exhibited inductance densities of up to 100 nH/mm 2 and quality factors approaching 20 in the frequency range of interest. Transformers were formed by interleaving primary and secondary coils and were designed with increased inductance in the secondary coil for voltage gain. A fabricated transformer, 1.5 mm × 1.5 mm in area, yielded 46 nH primary inductance and 500 nH secondary inductance with a coupling coefficient of 0.63. Measurements indicated that a maximum transformer efficiency of 78% at 125 MHz would be possible.
Published in: IEEE Transactions on Magnetics ( Volume: 46, Issue: 6, June 2010)
Page(s): 2236 - 2239
Date of Publication: 20 May 2010

ISSN Information:

Citations are not available for this document.

I. Introduction

Low-Mass, low-volume, high-efficiency switch-mode dc-dc power converters are essential for compact, battery-powered, electronic devices. These power converters have traditionally relied on high-performance, discrete inductors, and transformers. Integration of the magnetic passives could reduce the size of the power units, but materials processing complexities and performance limitations have remained an obstacle to on-chip integration [1].

Cites in Papers - |

Cites in Papers - IEEE (48)

Select All
1.
Pichao Pan, Changnan Chen, Jiebin Gu, Min Liu, Xinxin Li, "High-Performance 3-D Silicon-Embedded Coupled Solenoid Inductors With Inserted Magnetic Core", IEEE Transactions on Electron Devices, vol.71, no.5, pp.3169-3174, 2024.
2.
Haiwang Li, Kaibo Lei, Kaiyun Zhu, Yuqian Ma, Wenbing Wang, Tiantong Xu, "Ultra-High-Isolation Mutual-Embedded Transformer in Organic Substrate for Digital Isolator", IEEE Electron Device Letters, vol.45, no.4, pp.665-668, 2024.
3.
Changnan Chen, Pichao Pan, Jiebin Gu, Min Liu, Xinxin Li, "Design and Wafer-Level Fabrication of Stacked-Type Transformers for High-Density Power Converters", IEEE Transactions on Power Electronics, vol.39, no.4, pp.4503-4512, 2024.
4.
Shikai Chen, Yanfeng Chen, Bo Zhang, Dongyuan Qiu, "Very-High-Frequency Resonant Dual-Channel LED Driver With Capacitive Current Balance and Low Voltage Stress on Diodes", IEEE Transactions on Power Electronics, vol.38, no.12, pp.15032-15044, 2023.
5.
Changnan Chen, Pichao Pan, Jiebin Gu, Xinxin Li, "High-Inductance-Density MEMS 3D-solenoid Transformers with Inserted Thin-Film Ferrite Magnetic Core For On-Chip Integrated DC-DC Power Conversions", 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), pp.49-52, 2023.
6.
Changnan Chen, Pichao Pan, Dongfeng Lyu, Jiebin Gu, Min Liu, Xinxin Li, "Wafer-Level Fabricated Tight-Coupling Dual-Solenoid Transformer Chips With Watt-Scale Power Transfer", IEEE Transactions on Power Electronics, vol.38, no.4, pp.5118-5127, 2023.
7.
Michael Solomentsev, Alex J. Hanson, "At What Frequencies Should Air-Core Magnetics Be Used?", IEEE Transactions on Power Electronics, vol.38, no.3, pp.3546-3558, 2023.
8.
Michael Solomentsev, Alex J. Hanson, "At what frequencies should air-core magnetics be used?", 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), pp.625-632, 2022.
9.
Changnan Chen, Nianying Wang, Jiebin Gu, Xinxin Li, "Wafer-Level Fabricated Double-Helix Rf-Mems Transformers with Coupling-Factor of 0.93@100Mhz For High-Efficiency Isolated Power/Signal Transmission", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), pp.200-203, 2022.
10.
Muhammad Awais ASLAM, Hudair SAMAD, Fahimullah KHAN, Kashif RIAZ, "Micromachined air core meander transformer for on-chip wireless high frequency applications", 2021 International Bhurban Conference on Applied Sciences and Technologies (IBCAST), pp.946-950, 2021.
11.
Saket Jha, Sonam Acharya, Santanu Mishra, "Design and Performance Evaluation of an Air-Core Inductor for Point-of-Load (POL) Converter", 2020 IEEE Energy Conversion Congress and Exposition (ECCE), pp.3280-3285, 2020.
12.
Farès Tounsi, Denis Flandre, Libor Rufer, Laurent A. Francis, "Performances Evaluation of On-Chip Large-Size-Tapped Transformer for MEMS Applications", IEEE Transactions on Instrumentation and Measurement, vol.69, no.9, pp.7051-7060, 2020.
13.
Yixiao Ding, Xiangming Fang, Rongxiang Wu, Qili Guo, Johnny K. O. Sin, "A Suspended Thick-Winding Inductor for Integrated Voltage Regulator Applications", IEEE Electron Device Letters, vol.41, no.1, pp.95-98, 2020.
14.
Godwin Kwun Yuan Ho, Yaoran Fang, Bryan M. H. Pong, "A Multiphysics Design and Optimization Method for Air-Core Planar Transformers in High-Frequency LLC Resonant Converters", IEEE Transactions on Industrial Electronics, vol.67, no.2, pp.1605-1614, 2020.
15.
Yixiao Ding, Xiangming Fang, Rongxiang Wu, Qili Guo, Johnny K. O. Sin, "A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors", 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), pp.142-145, 2019.
16.
Vladimir Butuzov, Alexey Nazarenko, Yuri Bocharov, Oleg Kus, Vitaly Prokopyev, Nikita Dmitriev, Evgeny Smirnov, Tatiana Smirnova, Aleksei Trofimov, Nikolay Salynsky, "Micro-Transformer-Based Integrated Digital Isolator in 180/90 nm CMOS", 2019 International Siberian Conference on Control and Communications (SIBCON), pp.1-4, 2019.
17.
Jinyu Zhang, Yifan Zhang, "Optimized Low-Power Flexible Magnetic-Coupling Antenna for Wearable Devices", IEEE Transactions on Antennas and Propagation, vol.67, no.1, pp.65-73, 2019.
18.
Zhang Jin-Yu, Zhang Yi-Fan, "Micro-Power Antenna With Adjustable Q-Factor and Radiation Distribution", IEEE Access, vol.6, pp.50599-50608, 2018.
19.
Zana Kari, Dagal Yaya, Nicole Doumit, Karima Tayeboun, Jean Jacques Rousseau, "Study of electromagnetic radiation of integrated planar inductors", 2017 5th International Conference on Electrical Engineering - Boumerdes (ICEE-B), pp.1-7, 2017.
20.
Amal El-Ghazaly, Robert M. White, Shan X. Wang, "Gigahertz-Band Integrated Magnetic Inductors", IEEE Transactions on Microwave Theory and Techniques, vol.65, no.12, pp.4893-4900, 2017.
21.
Agasthya Ayachit, Marian K. Kazimierczuk, "Self-Capacitance of Single-Layer Inductors With Separation Between Conductor Turns", IEEE Transactions on Electromagnetic Compatibility, vol.59, no.5, pp.1642-1645, 2017.
22.
Andrea Marić, Goran Radosavljević, Nelu Blaž, Ljiljana Živanov, "Influence of substrate thickness on performance of LTCC micro-transformer", 2016 39th International Spring Seminar on Electronics Technology (ISSE), pp.510-514, 2016.
23.
Tim Schroeder, Joerg Froemel, Shuji Tanaka, Thomas Gessner, "Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies", 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), pp.401-404, 2016.
24.
Fahimullah Khan, Yong Zhu, Junwei Lu, Jitendra Pal, "Design and Implementation of Single-Layer Symmetric Micro-Transformers", IEEE Transactions on Magnetics, vol.52, no.6, pp.1-5, 2016.
25.
Zhiliang Zhang, Jingya Lin, Yuan Zhou, Xiaoyong Ren, "Analysis and Decoupling Design of a 30 MHz Resonant SEPIC Converter", IEEE Transactions on Power Electronics, vol.31, no.6, pp.4536-4548, 2016.
26.
Fahimullah Khan, Yong Zhu, Junwei Lu, Jitendra Pal, Dzung Viet Dao, "Micromachined Coreless Single-Layer Transformer Without Crossovers", IEEE Magnetics Letters, vol.6, pp.1-4, 2015.
27.
Iain M. Kierzewski, Lauren Boteler, Sarah S. Bedair, Christopher D. Meyer, Brendan M. Hanrahan, Nathan Lazarus, "Electroplated Copper for Heterogeneous Die Integration", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.5, no.7, pp.895-901, 2015.
28.
S.S. Bedair, J.S. Pulskamp, R.G. Polcawich, R.Q. Rudy, J. Puder, "Thin-film piezoelectric transformers operating in harmonics of out-of-plane flexure modes", 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp.714-717, 2015.
29.
Rongxiang Wu, Niteng Liao, Xiangming Fang, Johnny K. O. Sin, "A novel 3D transformer for ultra-compact signal isolation", 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), pp.297-300, 2015.
30.
Yichao Tang, Bruce Lee, Mert Vural, Peter Kofinas, Alireza Khaligh, "Toward flexible ferromagnetic-core inductors for wearable electronic converters", 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), pp.2540-2545, 2015.

Cites in Papers - Other Publishers (33)

1.
Zhikun Zhou, Baohe Zhang, Zihan Zhang, Xianchao Wei, Lei Sang, Wen Huang, "Progress on 3D tubular passive electronics: Residual stress-based fabrication, application, and modeling", Applied Physics Letters, vol.124, no.15, 2024.
2.
Jianyong Lou, Haixia Ren, Xia Chao, Kesong Chen, Haodong Bai, Zhengyue Wang, "Recent Progress in the Preparation Technologies for Micro Metal Coils", Micromachines, vol.13, no.6, pp.872, 2022.
3.
N.G. Akdogan, Y. Odeh, H.A. Alshammari, O. Zirhli, O. Akdogan, "Highly anisotropic magneto responsive SU8/Fe ink for additive manufacturing", Journal of Magnetism and Magnetic Materials, vol.541, pp.168526, 2022.
4.
Arash Dehestani Kolagar, Ali Abdollahi Arjanaki, Mohammad Reza Alizadeh Pahlavani, "A Novel Approach for Determining the Equivalent Circuit of Dummy Load Inductor in Loran Transmitter Considering Parasitic Capacitor", Journal of The Institution of Engineers (India): Series B, vol.101, no.6, pp.763, 2020.
5.
Chao Shan, Chengjun Zhang, Jie Liang, Qing Yang, Hao Bian, Jiale Yong, Xun Hou, Feng Chen, "3D integrated coreless microtransformer processed by femtosecond laser micro/nano fabrication", Journal of Micromechanics and Microengineering, vol.30, no.10, pp.105002, 2020.
6.
Dalvir K. Saini, Agasthya Ayachit, Marian K. Kazimierczuk, "Design and characterisation of single-layer solenoid air-core inductors", IET Circuits, Devices & Systems, vol.13, no.2, pp.211-218, 2019.
7.
Qing Yang, Feng Chen, Chao Shan, Jinwei Duan, "3D microtransformers with air core inside fused silica", Third International Conference on Photonics and Optical Engineering, pp.75, 2019.
8.
Nathan Lazarus, Sarah S. Bedair, Gabriel L. Smith, "Creating 3D printed magnetic devices with ferrofluids and liquid metals", Additive Manufacturing, vol.26, pp.15, 2019.
9.
Kristin Angel, Harvey H. Tsang, Sarah S. Bedair, Gabriel L. Smith, Nathan Lazarus, "Selective electroplating of 3D printed parts", Additive Manufacturing, vol.20, pp.164, 2018.
10.
Nathan Lazarus, Sarah S. Bedair, Iain M. Kierzewski, "Ultrafine Pitch Stencil Printing of Liquid Metal Alloys", ACS Applied Materials & Interfaces, 2017.
11.
Victor Farm-Guoo Tseng, Sarah S Bedair, Nathan Lazarus, "3D electroplated inductors with thickness variation for improved broadband performance", Journal of Micromechanics and Microengineering, vol.27, no.1, pp.015006, 2017.
12.
Lawrence E. Murr, "Innovations in Magnetic Materials", Handbook of Materials Structures, Properties, Processing and Performance, pp.1, 2016.
13.
Getinet Ashebir, Serges Zambou, Ulrich Männl, Rhyme Setshedi, Margit Härting, David T. Britton, "Fully screen printed LRC resonant circuit", Microelectronic Engineering, vol.162, pp.6, 2016.
14.
"Bibliography", Power Systems?On?Chip, pp.285, 2016.
15.
F. Khan, Y. Zhu, J. Lu, J. Pal, "A novel single metal layer MEMS-based step-down transformer", Microelectronics Journal, vol.57, pp.48, 2016.
16.
Saravana Mariappan, Ali Moazenzadeh, Ulrike Wallrabe, "Polymer Magnetic Composite Core Based Microcoils and Microtransformers for Very High Frequency Power Applications", Micromachines, vol.7, no.4, pp.60, 2016.
17.
N Lazarus, C D Meyer, "Stretchable inductor with liquid magnetic core", Materials Research Express, vol.3, no.3, pp.036103, 2016.
18.
Lawrence E. Murr, "Innovations in Magnetic Materials", Handbook of Materials Structures, Properties, Processing and Performance, pp.1011, 2015.
19.
Mohammad Zayed Ahmed, M.S. Bhuyan, A.K.M. Tariqul Islam, B.Y. Majlis, "Design and Fabrication of a MEMS 3D Micro-transformer for Low Frequency Applications", Asian Journal of Scientific Research, vol.8, no.2, pp.237, 2015.
20.
Sang Hyun Byun, Junqi Yuan, Myung Gon Yoon, Sung Kwon Cho, "Wirelessly powered electrowetting-on-dielectric (EWOD) by planar receiver coils", Journal of Micromechanics and Microengineering, vol.25, no.3, pp.035019, 2015.
21.
Lawrence E. Murr, "Innovations in Magnetic Materials", Handbook of Materials Structures, Properties, Processing and Performance, pp.1, 2014.
22.
Christopher D. Meyer, Sarah S. Bedair, Brian C. Morgan, Xue Lin, Rizwan Bashirullah, David P. Arnold, Iain M. Kierzewski, Nathan S. Lazarus, "Power management for small scale systems", Micro- and Nanotechnology Sensors, Systems, and Applications VI, vol.9083, pp.90831U, 2014.
23.
Sarah S. Bedair, Christopher D. Meyer, Nathan Lazarus, Christopher Dougherty, Jeffrey S. Pulskamp, Brian Morgan, Ronald Polcawich, Xue Lin, Rizwan Bashirullah, Iain Kierzewski, Joel Martin, Brian Power, "MEMS-based and switched-capacitor approaches for miniature power supply applications", Micro- and Nanotechnology Sensors, Systems, and Applications VI, vol.9083, pp.90831T, 2014.
24.
S S Bedair, J S Pulskamp, C D Meyer, R G Polcawich, I M Kierzewski, "Modeling, fabrication and testing of MEMS tunable inductors varied with piezoelectric actuators", Journal of Micromechanics and Microengineering, vol.24, no.9, pp.095017, 2014.
25.
"Integrated Inductors", High-Frequency Magnetic Components, pp.472, 2013.
26.
"Electromechanics of magnetic MEMS devices", Electromechanics and MEMS, pp.399, 2013.
27.
V F G Tseng, H Xie, "Design and fabrication of a high-density multilayer metal–insulator–metal capacitor based on selective etching", Journal of Micromechanics and Microengineering, vol.23, no.3, pp.035025, 2013.
28.
Jungkwun Kim, Florian Herrault, Xuehong Yu, Minsoo Kim, Richard H Shafer, Mark G Allen, "Microfabrication of air core power inductors with metal-encapsulated polymer vias", Journal of Micromechanics and Microengineering, vol.23, no.3, pp.035006, 2013.
29.
A Moazenzadeh, N Spengler, R Lausecker, A Rezvani, M Mayer, J G Korvink, U Wallrabe, "Wire bonded 3D coils render air core microtransformers competitive", Journal of Micromechanics and Microengineering, vol.23, no.11, pp.114020, 2013.
30.
N Lazarus, C D Meyer, S S Bedair, X Song, L M Boteler, I M Kierzewski, "Thick film oxidation of copper in an electroplated MEMS process", Journal of Micromechanics and Microengineering, vol.23, no.6, pp.065017, 2013.
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