Abstract:
This paper will describe a modular technology which uses a novel integration scheme to include double poly EEPROM, single poly EPROM and an interpoly capacitor. The singl...Show MoreMetadata
Abstract:
This paper will describe a modular technology which uses a novel integration scheme to include double poly EEPROM, single poly EPROM and an interpoly capacitor. The single poly EPROM [1] has been adopted to simplify the integration issues; the three modules (EEPROM, EPROM and A/D) can be combined in any combination without affecting their electrical performance.
Date of Conference: 10-13 September 1990
Date Added to IEEE Xplore: 22 March 2010
Print ISBN:0-7503-0065-5
Conference Location: Nottingham, UK
