Abstract:
The authors describe a packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic (OE) modules. They use a special OE component-to-singlemode...Show MoreMetadata
Abstract:
The authors describe a packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic (OE) modules. They use a special OE component-to-singlemode fiber (SMF) coupling arrangement showing up 92% coupling efficiency. In order to attach the fiber to the device and to insure the stability of the alignment, YAG laser welding technique is used. This yields to packaging excess losses ranging from 0.3 to 1 dB. Furthermore, a special device holder has been developed to allow very high speed devices, easy and effective link between several devices.
Date of Conference: 21-24 May 1995
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-7803-2736-5
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CNET patent pending
