Loading [MathJax]/extensions/MathMenu.js
Quasi-static field analysis of SAW devices with arbitrary geometries of electrodes and of metallic enclosures | IEEE Journals & Magazine | IEEE Xplore

Scheduled Maintenance on Monday 1/13/2025

Single article sales and account management will be unavailable from 5:00 AM - 7:00 PM ET (09:00 - 23:00 UTC). We apologize for the inconvenience.

  • IEEE.org
  • IEEE Xplore
  • IEEE SA
  • IEEE Spectrum
  • More Sites
    • Donate
    • Personal Sign In
IEEE Xplore logo - Link to home
MIT Libraries logo
Access provided by:
MIT Libraries
Sign Out
IEEE logo - Link to IEEE main site homepage
MIT Libraries logo
Access provided by:
MIT Libraries
Sign Out
ADVANCED SEARCH
Journals & Magazines >IEEE Transactions on Ultrason... >Volume: 41 Issue: 5

Quasi-static field analysis of SAW devices with arbitrary geometries of electrodes and of metallic enclosures

PDF
H. Reichinger; A.-R. Baghai-Wadji
All Authors
  • Alerts

    Alerts

    Manage Content Alerts
    Add to Citation Alerts

Abstract
Authors
References
Citations
Keywords
Metrics
More Like This
  • Download PDF
  • Download References
  • Request Permissions
  • Save to
  • Alerts

Abstract:

An easy-to-implement, accurate, and fast method to calculate 2-D quasi-static capacitance and inductance of electrodes in SAW devices is presented. The method is outlined...Show More

Metadata

Abstract:

An easy-to-implement, accurate, and fast method to calculate 2-D quasi-static capacitance and inductance of electrodes in SAW devices is presented. The method is outlined by considering electrodes with any cross-section geometries in dielectric environment, consisting of two anisotropic materials with a plane interface. The analysis allows the inclusion of arbitrarily shaped metallic packages. A significant shift of charges on enclosures, due to the substrate anisotropy, is observed.<>
Published in: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control ( Volume: 41, Issue: 5, September 1994)
Page(s): 785 - 787
Date of Publication: 06 August 2002

ISSN Information:

PubMed ID: 18263267
DOI: 10.1109/58.308515

Contact IEEE to Subscribe
More Like This
Electrostatic field analysis of surface acoustic wave devices: A three-dimensional representation

[1991 Proceedings] 6th Mediterranean Electrotechnical Conference

Published: 1991

The k-model - green's function based analysis of surface acoustic wave devices

IEEE Ultrasonics Symposium, 2005.

Published: 2005

Show More

References

References is not available for this document.

IEEE Personal Account

  • Change username/password

Purchase Details

  • Payment Options
  • View Purchased Documents

Profile Information

  • Communications Preferences
  • Profession and Education
  • Technical interests

Need Help?

  • US & Canada: +1 800 678 4333
  • Worldwide: +1 732 981 0060
  • Contact & Support

Follow

About IEEE Xplore | Contact Us | Help | Accessibility | Terms of Use | Nondiscrimination Policy | IEEE Ethics Reporting | Sitemap | IEEE Privacy Policy

A public charity, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.

© Copyright 2025 IEEE - All rights reserved, including rights for text and data mining and training of artificial intelligence and similar technologies.

IEEE Account

  • Change Username/Password
  • Update Address

Purchase Details

  • Payment Options
  • Order History
  • View Purchased Documents

Profile Information

  • Communications Preferences
  • Profession and Education
  • Technical Interests

Need Help?

  • US & Canada: +1 800 678 4333
  • Worldwide: +1 732 981 0060
  • Contact & Support
  • About IEEE Xplore
  • Contact Us
  • Help
  • Accessibility
  • Terms of Use
  • Nondiscrimination Policy
  • Sitemap
  • Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.
© Copyright 2025 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.

Test Whats new message.

Learn More