Abstract:
The successful realization of many high-performance microactuators, including many microvalves and micropumps, depends critically on the development of diaphragms which a...Show MoreMetadata
First Page of the Article
Abstract:
The successful realization of many high-performance microactuators, including many microvalves and micropumps, depends critically on the development of diaphragms which are capable of large displacements and free from fatigue. Thin nonplanar silicon diaphragms are promising candidates for such applications since they can be batch fabricated using techniques and materials that are compatible with the other portions of these devices. This paper reports the detailed simulation, fabrication, and characterization of such diaphragms, which are corrugated-bossed structures that unfold, accordion-like, to produce high boss deflections. Boron-doped diaphragms 1 mm on a side, 3 /spl mu/m in thickness, and containing five 10-/spl mu/m-deep corrugations produce boss deflections of more than 30 /spl mu/m at 760 mmHg, in close agreement with simulations. The maximum deflection measured at diaphragm fracture is 38 /spl mu/m under a 1050 mmHg differential pressure. The effects on load-deflection performance due to changes in diaphragm internal stress (residual stress), corrugation profile, and diaphragm thickness are also explored.<>
Published in: Journal of Microelectromechanical Systems ( Volume: 3, Issue: 2, June 1994)
DOI: 10.1109/84.294322
First Page of the Article
References is not available for this document.
Select All
1.
J. Ji, J. Chaney, M. Kaviany, P. L. Bergstrom and K. D. Wise, "Microactuation based on thermally-driven phase change", Dig. IEEE Int. Conf. on Solid-State Sensors and Actuators, pp. 1037-1040, 1991-June.
2.
C. J. Mullem, Κ. J. Gabriel and H. Fujita, "Large deflection performance of surface micromachined corrugated diaphragms", Dig. IEEE Int. Conf. on Solid-State Sensors and Actuators, pp. 1014-1017, 1991-June.
3.
J. H. Jerman, "The fabrication and use of micromachined corrugated silicon diaphragms", Sensors Actuators, vol. A21-A23, pp. 988-992, 1990.
4.
M. D. Giovami, Flat and Corrugated Diaphragm Design Handbook, New York:Marcel Dekker, 1982.
5.
J. A. Haringx, "Design of corrugated diaphragm", ASME Trans., vol. 77, pp. 55, 1957.
6.
S. T. Cho, K. Najafi and K. D. Wise, "Scaling and dielectric stress compensation of ultrasensitive boron-doped silicon microstructures", IEEE Trans. Electron Devices, vol. 39, pp. 836-842, April 1992.
7.
Y. Zhang, S. B. Crary and K. D. Wise, "Pressure sensor design and simulation using the CAEMEMS-D module", Dig. IEEE Solid-State Sensor and Actuator Workshop, pp. 32-35, 1990-June.
8.
H.-L. Chau and K. D. Wise, "Scaling limits in batch fabricated silicon pressure sensors", IEEE Trans. Electron Devices, vol. 34, pp. 55, 1987.
9.
X. Ding, W. Ko and J. M. Mansour, " Residual stress andmechanical properties of boron-doped p + silicon films ", Sensors and Actuators, vol. A21-A23, pp. 866-871, 1990.
10.
X. Ding and W. Ko, " Buckling behavior of boron-doped p + silicon diaphragms ", Dig. IEEE Int. Conf. on Solid-State Sensors and Actuators, pp. 201-204.
11.
W. Chu, M. Mehregany, D. Hansford and P. Pirouz, " Effect of thermal oxidation on residual stress distribution through the thickness of p + silicon films ", Dig. IEEE Solid-State Sensor and Actuator Workshop, pp. 90-93, 1992-June.
12.
I. N. Smirnov, "Coefficient representing the deformation of the silicon lattice as a result of diffusion of boron and antimony", Sov. Phys. Solid State, vol. 19, pp. 859-860, 1977.
13.
A. Bohg, "Ethylene diamine-pyrocatechol-water mixture shows etching anomaly in boron-doped silicon", J. Electrochem. Soc., vol. 118, no. 2, pp. 401-402, Feb. 1971.
14.
H. Seidel, L. Csepregi, A. Heuberger and H. Bauingartel, "Anisotropic etching of crystalline silicon in alkaline solutions II influence of dopants", J. Electrochem. Soc., vol. 137, no. 11, pp. 3626-3632, Nov. 1990.
15.
X. Ding, "Behavior and application of silicon diaphragms with a boss and corrugation", Dig. IEEE Solid-State Sensor and Actuator Workshop, pp. 166-169, 1992-June.
16.
N. Willems, J. T. Easley and S. T. Rolfe, Strength of Materials, New York:McGraw-Hill, 1981.
17.
ANSYS Users Manual Vol. IV: Theory, 1992.
18.
S. P. Timoshenko, History of Strength of Materials, New York:McGraw-Hill, 1953.
19.
K. Najafi, J. Ji and K. D. Wise, "Scaling limitations of silicon multichannel recording probes", IEEE Trans. Biomed. Engr., vol. 37, pp. 1-11, January 1990.
20.
L. E. Andreeva, Elastic Elements of Instruments, Jerusalem:Israel Program for Scientific Translation, 1966.
21.
J. A. Haringx, "The Rigidity of corrugated diaphragms", Appl. Sci. Res., vol. A2, pp. 295-325, 1950.
