Loading web-font TeX/Math/Italic
Accumulation gate capacitance of MOS devices with ultrathin high-/spl kappa/ gate dielectrics: modeling and characterization | IEEE Journals & Magazine | IEEE Xplore

Accumulation gate capacitance of MOS devices with ultrathin high-/spl kappa/ gate dielectrics: modeling and characterization


Abstract:

A quantum-mechanical (QM) model is presented for accumulation gate capacitance of MOS structures with high-/spl kappa/ gate dielectrics. The model incorporates effects du...Show More

Abstract:

A quantum-mechanical (QM) model is presented for accumulation gate capacitance of MOS structures with high-/spl kappa/ gate dielectrics. The model incorporates effects due to penetration of wave functions of accumulation carriers into the gate dielectric. Excellent agreement is obtained between simulation and experimental C-V data. It is found that the slope of the C-V curves in weak and moderate accumulation as well as gate capacitance in strong accumulation varies from one dielectric material to another. Inclusion of penetration effect is essential to accurately describe this behavior. The physically based calculation shows that the relationship between the accumulation semiconductor capacitance and Si surface potential may be approximated by a linear function in moderate accumulation. Using this relationship, a simple technique to extract dielectric capacitance for high-/spl kappa/ gate dielectrics is proposed. The accuracy of the technique is verified by successfully applying the method to a number of different simulated and experimental C-V characteristics. The proposed technique is also compared with another method available in the literature. The improvements made in the proposed technique by properly incorporating QM and other physical effects are clearly demonstrated.
Published in: IEEE Transactions on Electron Devices ( Volume: 53, Issue: 6, June 2006)
Page(s): 1364 - 1372
Date of Publication: 30 May 2006

ISSN Information:


I. Introduction

The continuous scaling of MOSFETs, as outlined in the International Technology Roadmap for Semiconductors (ITRS) [1], requires that should be replaced by high- dielectric materials as gate insulators to avoid excessive direct tunneling gate current and reliability problems. Significant advances have been made in recent years in realizing MOS devices with good quality high- gate dielectric materials. A review of this topic may be found in [2].

Contact IEEE to Subscribe

References

References is not available for this document.