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Uncooled mini-DIL module for 980-nm pump lasers | IEEE Journals & Magazine | IEEE Xplore

Uncooled mini-DIL module for 980-nm pump lasers


Abstract:

The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm m...Show More

Abstract:

The importance of lower cost while maintaining high performance of erbium-doped fiber amplifiers (EDFAs) is growing with increased bandwidth demand. The uncooled 980-nm miniature dual-inline (Mini-DIL) pump laser is attractive for compact EDFA designs because it offers the advantages of lower cost, smaller footprint, minimal heat generation, and reduced electrical power consumption. In this paper, we report a low-cost uncooled Mini-DIL module designed for 980-nm pump lasers. A three-dimensional finite element analysis model effectively predicts module thermal and stress performance. Experimental results of module power and coupling efficiency stability over assembly processes are presented. A minimum optical output power of 150 mW is achieved in a group of 10 devices across a temperature range of 0/spl deg/C to 70/spl deg/C at a drive current of 350 mA with a 1.5-mm raised ridge InGaAs/AlGaAs single quantum well laser chip.
Published in: IEEE Transactions on Advanced Packaging ( Volume: 29, Issue: 1, February 2006)
Page(s): 171 - 177
Date of Publication: 28 February 2006

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Nomenclature

(°C)

Temperature.

(°C)

Ambient package temperature.

, (K)

Characteristic temperatures.

(mA)

Characteristic threshold current.

(mA)

Threshold current.

(W/A)

Characteristic slope efficiency.

(W/A)

Chip slope efficiency.

(mA)

Laser driving current.

(W/m-K)

Thermal conductivity.

Coupling efficiency as a function of temperature.

Relative coupling efficiency change as a function of temperature.

Coupling efficiency stability.

Power change.

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