I. Introduction
With the trends of fast edge rates, high clock frequencies, and low voltage levels for the high-speed digital computer systems, the ground bounce noise (GBN) or simultaneously switching noise (SSN) on the power/ground planes is becoming one of the major challenges for designing the high-speed circuits. Because of the parallel-plate waveguide structure between power and ground planes in the advanced high-speed packages, the resonance modes of the parallel-plate waveguide can be excited by the GBN. Research has shown the resonance noise propagating between the power and ground planes could cause serious signal integrity (SI) or power integrity (PI) problems for the high-speed circuits [1]–[3]. Moreover, due to the cavity resonance effect between the power/ground planes, the GBN also results in significant radiated emissions or electromagnetic interference (EMI) issues [3].