I. Introduction
CMOS CIRCUITS have traditionally been fabricated on silicon substrates with a (100) crystalline orientation due to their high electron mobility and reduced interface trap density. Hole mobility, however, is very low in the (100) orientation, but can be improved by using alternative surface orientations [1]–[3]. The potential use of alternative surface orientations has been studied in the past [2], [4], [5] and shown to be beneficial in improving pMOSFET device performance. However, practical application of such a scheme has been limited by the degradation of device reliability due to interface traps [6]. Furthermore, in order to achieve different orientations, it could be necessary to fabricate devices on trench sidewalls [4], [5]. Recently, it was reported that with gate dielectrics thicknesses now in the direct-tunneling regime, reliability is no longer dependent on the silicon crystal orientation [7]. This removes the primary limitation of non-(100) silicon substrates, thus making them a viable option for the optimization of CMOS circuits.