Quantitative assessment of mobility degradation by remote Coulomb scattering in ultra-thin oxide MOSFETs: measurements and simulations | IEEE Conference Publication | IEEE Xplore

Quantitative assessment of mobility degradation by remote Coulomb scattering in ultra-thin oxide MOSFETs: measurements and simulations


Abstract:

In this paper, we report measurements of electron effective mobility (/spl mu//sub eff/) in ultra-thin (UT) pure SiO/sub 2/ bulk MOSFETs. A low substrate doping was inten...Show More

Abstract:

In this paper, we report measurements of electron effective mobility (/spl mu//sub eff/) in ultra-thin (UT) pure SiO/sub 2/ bulk MOSFETs. A low substrate doping was intentionally used to better detect a possible /spl mu//sub eff/ degradation at small T/sub ox/. New quantitative criteria were developed and used to obtain /spl mu//sub eff/ measurements unaffected by either gate doping penetration or gate oxide leakage. Mobility simulations, based on an improved and comprehensive remote Coulomb scattering (RCS) model, exhibit a good agreement with the experimentally observed mobility reduction at small T/sub ox/. Our results indicate that polysilicon screening is an essential ingredient to reconcile the RCS models with the experiments.
Date of Conference: 08-10 December 2003
Date Added to IEEE Xplore: 03 March 2004
Print ISBN:0-7803-7872-5
Conference Location: Washington, DC, USA

I. Introduction

The RCS with the ionized impurities in the polysilicon has been regarded as the possible origin of the degradation of effective mobility in Ultra-Thin (UT) gate oxide MOSFETs [1], [2], and its quantitative understanding is also very important to assess the effect on of the fixed charges in the stacks of High-K gate dielectrics [3].

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References

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