Macroscopic and microscopic thermal management of a planar integrated optical device

We present a detailed concept for microscopic and macroscopic thermal management of a planar, integrated optical device. Deep-etched grooves minimize the power consumption of thermo-optical switches. The layout minimize thermal crosstalk between different components.

1. Introduction

Optical components for the next generation of optical networks need to achieve two seemingly contradicting goals: Performance and flexibility has to increase, whereas size, cost and power consumption need to decrease. Following the example of micro-electronics, higher integration of multiple optical functionalities is one way to meet this challenge. Planar lightwave circuit (PLC) technology has shown promising results as an integration platform for a numerous active and passive optical functions [1]–[3]