I. Introduction
Today, research efforts are focused on realizing large bandwidth computing systems through the use of additional process units [1], and the development of various embedded memories (EM) [2]. Among these, hafnia-based 1T-nC FRAM is proposed as a viable candidate for next-generation EM in advanced computing systems due to its high density and fast operation speed [3]–[5]. However, the integration of EM with logic devices limits the total height of EM because of cointegrated interconnections (Fig. 1) [6]. Specifically, the interconnection metal lines in logic circuits hinder the increase in the area (height) of cell capacitors for embedded DRAM, a representative EM, posing a significant obstacle for future technology development (Fig. 2(a)). In this regard, hafnia ferroelectric (FE) material offers a promising solution by providing a high property, which can overcome this limitation (Fig. 2(b)) [3]–[5]. Additionally, the non-volatile can significantly reduce the standby energy loss of typical EM [7].