Contents I. Introduction
Co-packaged optics (CPO) is a technology that integrates photonic integrated circuits (PICs) and electronic integrated circuits (EICs) on a single substrate, playing a crucial role in meeting the demands of high-bandwidth data transmission in data centers and high-performance computing environments. Optical I/O solutions based on CPO principles bring photonics and electronics into close proximity on a unified platform, facilitating the direct conversion of electrical signals into optical signals [1]. This capability is critical for achieving high-bandwidth data transmission with low power consumption, essential for modern data centers and high-performance computing systems [2]. The CPO market is projected to surpass $2.3 billion by 2030 [3].
