I. Introduction
Recently, the rapid growth of cloud computing and AI services has significantly increased the demand for low power consumption of data center networks. Conventionally, pluggable optical transceivers have been mounted at the front-end of substate, where electrical wiring on the board connects them and ASIC. In order to reduce the power consumption while keep increasing transmission data rate, the electrical wiring needs to be replaced by optical wiring even near logic IC. So, co-packaged optics (CPO) which is a new packaging technique using photonic integrated circuits (PICs), is drawing significant attention [1].