Demonstration of Thermal Characteristics of 3D Mirror-Based Optical Link for Co-Packaged Optics

The thermal tolerance of 3D mirror-based polymer optical link for co-packaged optics was demonstrated by both multi-physical analysis and experiment. The thermal-dependent difference of average insertion loss measured in the full O-band was 0.92 dB.

1. Introduction

Applications based on artificial intelligence are rapidly growing and they require network architectures using GPUs and CPUs in high-performance computing systems and large-scale datacenters for parallel execution [1]. Increasing In/Out (I/O) bandwidth causes challenges with respect to energy efficiency, latency, and density. Co-packaged optics (CPO) is an expected solution, where optical components are integrated on an electrical package substrate [2].