Contents 1. Introduction
Co-packaged optics (CPO) technology, which integrates photonics and electronics onto a single platform, is essential for achieving high-capacity data transmission with low power consumption in data centers and high-performance computing systems. In CPO, the optical interconnect technology between optical transceiver chip based on silicon (Si) photonics and optical fibers is of critical importance. Currently, direct coupling from Si waveguides to optical fibers is being researched [1], however, this direct coupling presents challenges due to high coupling losses and a complex assembly process. We propose an “Active Optical Package (AOP) Substrate” to connect embedded Si photonic integrated circuit (PIC) and optical fibers using three-dimensional mirrors, linking them with polymer waveguides [2]. The polymer waveguide offers better compatibility with organic substrate, low propagation loss, reduced costs, and simplified processing, presenting a significant advantage in CPO.
