Heterogeneous Photonics in Visible and Beyond

We present some recent advancements related to extending the wavelength range of heterogeneous silicon nitride photonic platform, achieved by integrating indium-phosphide, gallium-arsenide and gallium-nitride based active components in a wafer scale process.

1. Introduction

While fiber-based communications are a well-established market with clear roadmaps for increasing capacity and density (even if technology path to meet future requirements is not yet known), there are many emerging applications that can benefit from photonic integrated circuits (PICs) due to their potential for size, weight and power (SWaP) improvement, performance improvement, cost reduction and ability to scale.