A Multi-Objective Structural Optimization Method Based on Multi-Physics Simulations for Power Module

With the rise of wide-bandgap semiconductors SiC, power module packaging needs to be designed with all performance outstanding enough to give full play of advantages of SiC in harsh conditions. Due to the difficulty of taking into account all performance, packaging design of SiC power module faces great challenges. This study proposes a multi-objective structural optimization method based on Multiphysics simulation for power modules design, which combines Taguchi, TOPSIS, CRITIC, and entropy weight method to simplify the optimization process. Based on the proposed method, structural parameters of a SiC power module is optimized. According to the simulation results, a good effect of the compromise among the electrical, thermal, and mechanical performance is realized.