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A Novel Noncontact Differential Method for Current and Voltage Measurements on a Printed Trace Simultaneously | IEEE Journals & Magazine | IEEE Xplore

A Novel Noncontact Differential Method for Current and Voltage Measurements on a Printed Trace Simultaneously


Abstract:

Noncontact measurement of current and voltage poses various challenges in different applications. In this article, a novel differential reconstruction method for nonconta...Show More

Abstract:

Noncontact measurement of current and voltage poses various challenges in different applications. In this article, a novel differential reconstruction method for noncontact and simultaneous measurements of current and voltage as well as power on a printed trace is proposed. The principles and calculation procedures of the method are explained in detail. Compared with the previous segregated reconstruction method using a compact probe with both a current detector and voltage detector, the differential method employing a differential probe with a single-loop structure is well characterized through a series of comparison tests, including measured and calculated response tests, time delay difference tests, and reconstruction performance tests. Especially for time delay difference levels and the reconstruction performance, the proposed method is validated to exhibit a more than tenfold decrease in the time delay difference levels and a less than 5% average curve error. Finally, a real application involving the switching behaviors at the output of a customized pulsewidth modulation (PWM) generator module is presented with an average curve error of 3.8%. These results further support the feasibility and effectiveness of the proposed method.
Published in: IEEE Transactions on Microwave Theory and Techniques ( Volume: 72, Issue: 10, October 2024)
Page(s): 5848 - 5858
Date of Publication: 30 April 2024

ISSN Information:

Funding Agency:

Author image of Chengyang Luo
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), ...Show More
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), ...View more
Author image of Yichi Zhang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yichi Zhang was born in Guangzhou, China, in 1995. He received the B.S. degree in integrated circuit design and integration system and the Ph.D. degree in electronics science and technology from Xidian University, Xi’an, China, in 2017 and 2023, respectively.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as an Engineer of the Scienc...Show More
Yichi Zhang was born in Guangzhou, China, in 1995. He received the B.S. degree in integrated circuit design and integration system and the Ph.D. degree in electronics science and technology from Xidian University, Xi’an, China, in 2017 and 2023, respectively.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as an Engineer of the Scienc...View more
Author image of Weiheng Shao
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Weiheng Shao (Senior Member, IEEE) was born in Panjin, Liaoning, China, in 1989. He received the B.E. and M.E. degrees in electrical engineering from Northeastern University, Shenyang, China, in 2012 and 2014, respectively.
He works full-time at the China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI) while pursuing his Ph.D. degree in electronic information engineering part-time with ...Show More
Weiheng Shao (Senior Member, IEEE) was born in Panjin, Liaoning, China, in 1989. He received the B.E. and M.E. degrees in electrical engineering from Northeastern University, Shenyang, China, in 2012 and 2014, respectively.
He works full-time at the China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI) while pursuing his Ph.D. degree in electronic information engineering part-time with ...View more
Author image of Lei Wang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and served as an Engineer. His research interests include electromagnetic compa...Show More
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and served as an Engineer. His research interests include electromagnetic compa...View more
Author image of Wenxiao Fang
Department of Integrated Circuit, Sun Yat-sen University, Shenzhen, China
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun Yat-sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as a Senior Engin...Show More
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun Yat-sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as a Senior Engin...View more
Author image of Yiqiang Chen
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, No. 5 Electronics Research Institute of the Ministry of Industry and Informa...Show More
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, No. 5 Electronics Research Institute of the Ministry of Industry and Informa...View more
Author image of Raúl Fernández-García
Department of Electronic Engineering, Universitat Politecnica de Catalunya, Barcelona, Spain
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Barcelona, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to...Show More
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Barcelona, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to...View more

I. Introduction

Noncontact measurement of current and voltage has become a fundamental and increasingly significant concern in recent years. In the modern industrial settings, accurately measuring the transient behavior of signals on a printed trace in an industrial module is crucial for ensuring the reliability and safety of the electronic modules [1], [2], [3], [4], [5]. By monitoring this data, effective fault prediction and diagnosis can be conducted. To prevent any impact on the original circuit structures, the related tests aim to simultaneously monitor trace voltage and current on a module board in a noncontact manner.

Author image of Chengyang Luo
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, where he served as a Research Assistant of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. He currently goes back to the laboratory in China. His current research interests include textile UHF-RFID tags and sensing techniques, smart devices, signal integrity and power integrity (SIPI) analysis and noncontact voltage, and current and power measurement techniques.
Dr. Luo received the National China Scholarship Council-Universitat Politècnica de Catalunya (CSC-UPC) Scholarship, in 2019, for the Ph.D. degree from the Universitat Politecnica de Catalunya.
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, where he served as a Research Assistant of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. He currently goes back to the laboratory in China. His current research interests include textile UHF-RFID tags and sensing techniques, smart devices, signal integrity and power integrity (SIPI) analysis and noncontact voltage, and current and power measurement techniques.
Dr. Luo received the National China Scholarship Council-Universitat Politècnica de Catalunya (CSC-UPC) Scholarship, in 2019, for the Ph.D. degree from the Universitat Politecnica de Catalunya.View more
Author image of Yichi Zhang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yichi Zhang was born in Guangzhou, China, in 1995. He received the B.S. degree in integrated circuit design and integration system and the Ph.D. degree in electronics science and technology from Xidian University, Xi’an, China, in 2017 and 2023, respectively.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as an Engineer of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. His current research interests include microwave photonics techniques, near-infrared optoelectronic devices, and reliability of semiconductor devices.
Yichi Zhang was born in Guangzhou, China, in 1995. He received the B.S. degree in integrated circuit design and integration system and the Ph.D. degree in electronics science and technology from Xidian University, Xi’an, China, in 2017 and 2023, respectively.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as an Engineer of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. His current research interests include microwave photonics techniques, near-infrared optoelectronic devices, and reliability of semiconductor devices.View more
Author image of Weiheng Shao
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Weiheng Shao (Senior Member, IEEE) was born in Panjin, Liaoning, China, in 1989. He received the B.E. and M.E. degrees in electrical engineering from Northeastern University, Shenyang, China, in 2012 and 2014, respectively.
He works full-time at the China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI) while pursuing his Ph.D. degree in electronic information engineering part-time with South China University of Technology. Since 2020, he has also been a Co-Advisor for master’s degree at South China University of Technology, Guangzhou, China; Guangdong University of Technology, Guangzhou; and Southwest University of Science and Technology, Si Chuan, China. His current interests are the electromagnetic environment reliability in integrated circuits, component, and system level.
Weiheng Shao (Senior Member, IEEE) was born in Panjin, Liaoning, China, in 1989. He received the B.E. and M.E. degrees in electrical engineering from Northeastern University, Shenyang, China, in 2012 and 2014, respectively.
He works full-time at the China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI) while pursuing his Ph.D. degree in electronic information engineering part-time with South China University of Technology. Since 2020, he has also been a Co-Advisor for master’s degree at South China University of Technology, Guangzhou, China; Guangdong University of Technology, Guangzhou; and Southwest University of Science and Technology, Si Chuan, China. His current interests are the electromagnetic environment reliability in integrated circuits, component, and system level.View more
Author image of Lei Wang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and served as an Engineer. His research interests include electromagnetic compatibility and the design of circularly polarized microstrip antennas.
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and served as an Engineer. His research interests include electromagnetic compatibility and the design of circularly polarized microstrip antennas.View more
Author image of Wenxiao Fang
Department of Integrated Circuit, Sun Yat-sen University, Shenzhen, China
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun Yat-sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as a Senior Engineer of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, since 2011. In 2024, he joined the Department of Integrated Circuit, Sun Yat-sen University, as a Professor. His current interests include the electromagnetic compatibility in integrated circuits and component level, and electromagnetism application in power electronics.
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun Yat-sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, where he served as a Senior Engineer of the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, since 2011. In 2024, he joined the Department of Integrated Circuit, Sun Yat-sen University, as a Professor. His current interests include the electromagnetic compatibility in integrated circuits and component level, and electromagnetism application in power electronics.View more
Author image of Yiqiang Chen
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, No. 5 Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou, China. He is currently a Research Fellow. He has authored about 100 articles in journals and international conferences. His research interests include the failure mechanism and model of key devices, such as microwave devices and power devices, and prognostics and health management (PHM) of power conversion system (PCS) and system on chip (SoC).
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, No. 5 Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou, China. He is currently a Research Fellow. He has authored about 100 articles in journals and international conferences. His research interests include the failure mechanism and model of key devices, such as microwave devices and power devices, and prognostics and health management (PHM) of power conversion system (PCS) and system on chip (SoC).View more
Author image of Raúl Fernández-García
Department of Electronic Engineering, Universitat Politecnica de Catalunya, Barcelona, Spain
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Barcelona, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to 2007, he was a part-time Assistant Professor in electronics with the Department of Electronics Engineering, Universitat Autonoma de Barcelona. Funded by European Marie Curie Program, he worked on devices and circuits reliability at IMEC, Leuven, Belgium, from 2005 to 2006. From 2008 to 2011, he was a full-time Assistant Professor with the Department of Electronics Engineering, Universitat Politecnica de Catalunya, where he is currently an Associate Professor. He has authored or coauthored more than 110 articles in international journals and conferences and he has been involved in 18 research projects (six Principal Researchers) in different research activities including reliability, electromagnetic compatibility, and electronic textile. His current scientific interest is focused on wearable sensor development for sports and health applications.
Dr. Garcia was a recipient of the Best Paper Awards at International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA) 2007.
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Barcelona, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to 2007, he was a part-time Assistant Professor in electronics with the Department of Electronics Engineering, Universitat Autonoma de Barcelona. Funded by European Marie Curie Program, he worked on devices and circuits reliability at IMEC, Leuven, Belgium, from 2005 to 2006. From 2008 to 2011, he was a full-time Assistant Professor with the Department of Electronics Engineering, Universitat Politecnica de Catalunya, where he is currently an Associate Professor. He has authored or coauthored more than 110 articles in international journals and conferences and he has been involved in 18 research projects (six Principal Researchers) in different research activities including reliability, electromagnetic compatibility, and electronic textile. His current scientific interest is focused on wearable sensor development for sports and health applications.
Dr. Garcia was a recipient of the Best Paper Awards at International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA) 2007.View more
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