Loading [MathJax]/extensions/MathMenu.js
Noninvasive Flexible Current Probe as a Diagnosis Tool Inside a PWM Chopper Module | IEEE Journals & Magazine | IEEE Xplore

Noninvasive Flexible Current Probe as a Diagnosis Tool Inside a PWM Chopper Module


Abstract:

Traditional noncontact rigid probes fail to meet the time-domain reconstruction requirements inside industrial modules in an enclosed chamber. In this article, a flexible...Show More

Abstract:

Traditional noncontact rigid probes fail to meet the time-domain reconstruction requirements inside industrial modules in an enclosed chamber. In this article, a flexible current probe is proposed as a diagnosis tool to extend the noninvasive time-varying current reconstruction technology inside an industrial PWM-chopper module in an enclosed chamber. The flexibility of the probe allows for direct placement on trace surfaces or attachment to trace sides for current measurement without intrusion. Reflection coefficient curves obtained at typical bending angles demonstrate remarkable consistency with an average error of 0.63%. Furthermore, time-domain curves of reconstructed currents closely match directly measured currents with an average error below 0.24%. The flexible probe demonstrates consistent and stable performance across different bending levels in noninvasive current measurement tests. In the application tests, the experimental results validate its utility as a diagnostic tool for noninvasive time-varying current detection within an industrial PWM-chopper module, achieving an average error below 0.11%. Additionally, the proposed probe enables the detection of varying output currents for load failure analysis in constant voltage output modules.
Article Sequence Number: 6004907
Date of Publication: 25 March 2024

ISSN Information:

Funding Agency:

Author image of Chengyang Luo
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), ...Show More
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), ...View more
Author image of Rui Ding
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Rui Ding was born in Anhui, China, in 1996. He received the B.E. degree in electrical engineering and automation from the Wanjiang University of Technology, Ma’anshan, China, in 2023, and the M.S. degree in electrical engineering from the Anhui University of Technology, Ma On Shan, China.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His cur...Show More
Rui Ding was born in Anhui, China, in 1996. He received the B.E. degree in electrical engineering and automation from the Wanjiang University of Technology, Ma’anshan, China, in 2023, and the M.S. degree in electrical engineering from the Anhui University of Technology, Ma On Shan, China.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His cur...View more
Author image of Wenxiao Fang
Department of Integrated Circuit, Sun Yat-sen University, Shenzhen, China
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun-Yet Sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, and he has been served as ...Show More
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun-Yet Sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, and he has been served as ...View more
Author image of Lei Wang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively, where he is currently pursuing the Ph.D. degree.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and severed as an Engineer. Hi...Show More
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively, where he is currently pursuing the Ph.D. degree.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and severed as an Engineer. Hi...View more
Author image of Yiqiang Chen
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The No.5 Electronics Research Institute of the Ministry of Industry and Info...Show More
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The No.5 Electronics Research Institute of the Ministry of Industry and Info...View more
Author image of Raúl Fernández-García
Department of Electronic Engineering, Universitat Politecnica de Catalunya, Barcelona, Spain
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng. degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Bellaterra, Spain, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 ...Show More
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng. degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Bellaterra, Spain, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 ...View more

I. Introduction

Industrial module failure diagnostic tests are important for ensuring the reliability and safety of industrial electronic modules [1], [2], [3], [4], [5]. The popular electromagnetic immunity diagnostic tests include surge immunity tests (SITs), electrical fast transient/burst tests (EFTs), direct power injection tests (DPIs), and source-conducted emission tests (ISO 7637-2). In these electromagnetic immunity diagnostic tests, it is expected to monitor the interfered voltage or current in the transmission lines on the tested modules.

Author image of Chengyang Luo
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, where he served as a Research Assistant with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. In 2019, he received the National CSC-UPC Scholarship for his Ph.D. degree. Now, he goes back to the Laboratory in China. His current research interests include textile UHF-RFID tags and sensing techniques, smart devices, SIPI analysis and non-contact voltage, current, and power measurement techniques.
Chengyang Luo (Member, IEEE) was born in Hubei, China, in 1995. He received the B.Eng. degree in integrated circuit design and integration system from Xidian University, Xi’an, China, in 2017, and the Ph.D. degree in electronics engineering from the Universitat Politecnica de Catalunya, Barcelona, Spain, in 2022.
In 2017, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, where he served as a Research Assistant with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou. In 2019, he received the National CSC-UPC Scholarship for his Ph.D. degree. Now, he goes back to the Laboratory in China. His current research interests include textile UHF-RFID tags and sensing techniques, smart devices, SIPI analysis and non-contact voltage, current, and power measurement techniques.View more
Author image of Rui Ding
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Rui Ding was born in Anhui, China, in 1996. He received the B.E. degree in electrical engineering and automation from the Wanjiang University of Technology, Ma’anshan, China, in 2023, and the M.S. degree in electrical engineering from the Anhui University of Technology, Ma On Shan, China.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current research interests include electromagnetic compatibility and high-powerpulse.
Rui Ding was born in Anhui, China, in 1996. He received the B.E. degree in electrical engineering and automation from the Wanjiang University of Technology, Ma’anshan, China, in 2023, and the M.S. degree in electrical engineering from the Anhui University of Technology, Ma On Shan, China.
In 2023, he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current research interests include electromagnetic compatibility and high-powerpulse.View more
Author image of Wenxiao Fang
Department of Integrated Circuit, Sun Yat-sen University, Shenzhen, China
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun-Yet Sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, and he has been served as a Senior Engineer with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, since 2011. His current interests include the electromagnetic compatibility in integrated circuits and component level, and electromagnetism application in power electronics.
Wenxiao Fang received the B.S., M.S., and Ph.D. degrees in condensed-matter physics from Sun-Yet Sen University, Guangzhou, China, in 2002, 2005, and 2008, respectively.
He was a Visiting Scholar with Hong Kong University of Science and Technology, Hong Kong, in 2009. After that he joined China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China, and he has been served as a Senior Engineer with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, since 2011. His current interests include the electromagnetic compatibility in integrated circuits and component level, and electromagnetism application in power electronics.View more
Author image of Lei Wang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively, where he is currently pursuing the Ph.D. degree.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and severed as an Engineer. His research interests include electromagnetic compatibility analysis, design of antennas and near-field probes, and failure analysis of electronic component.
Lei Wang (Senior Member, IEEE) was born in Shanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2014 and 2017, respectively, where he is currently pursuing the Ph.D. degree.
After that, he joined China Electronic Produce Reliability and Environmental Testing Research Institute, Guangzhou, China, and severed as an Engineer. His research interests include electromagnetic compatibility analysis, design of antennas and near-field probes, and failure analysis of electronic component.View more
Author image of Yiqiang Chen
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou, China
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The No.5 Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou, China. He is currently a Research Fellow. He has published about 100 papers to journals and international conferences. His research interests include the failure mechanism and model of key devices, such as microwave devices, power devices and so on, prognostics and health management (PHM) of power conversion system (PCS) and system on chip (SoC).
Yiqiang Chen was born in Hunan, China, in 1982. He received the B.S. degree in microelectronics and the Ph.D. degree in materials science and engineering from Xiangtan University, Xiangtan, China, in 2006 and 2011, respectively.
In 2011, he joined the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The No.5 Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou, China. He is currently a Research Fellow. He has published about 100 papers to journals and international conferences. His research interests include the failure mechanism and model of key devices, such as microwave devices, power devices and so on, prognostics and health management (PHM) of power conversion system (PCS) and system on chip (SoC).View more
Author image of Raúl Fernández-García
Department of Electronic Engineering, Universitat Politecnica de Catalunya, Barcelona, Spain
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng. degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Bellaterra, Spain, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to 2007, he was an part-time Assistant Professor in electronics with the Department of Electronics Engineering, Universitat Autonoma de Barcelona. Funded by the European Marie Curie Program, he worked on devices and circuits reliability at IMEC (Belgium) between 2005 and 2006. From 2008 to 2011, he was a full-time Assistant Professor with the Department of Electronics Engineering, Universitat Politecnica de Catalunya. At present he is an Associate Professor with the Department of Electronics Engineering. He is author or a coauthor of more than 110 papers in international journals and conferences and he has been involved in 18 research projects (6 as principal researcher) in different research activities including reliability, electromagnetic compatibility and electronic textile. His current scientific interest is focused on wearable sensor development for sport and health applications.
Dr. Fernandez was a recipient of the Best Paper Awards at IPFA 2007.
Raúl Fernández-García received the B.Eng. degree in telecommunications and the M.Eng. degree in electronics from the Universitat Politecnica de Catalunya, Barcelona, in 1997 and 1999, respectively, and the Ph.D. degree from the Universitat Autonoma de Barcelona, Bellaterra, Spain, in 2007.
From 1998 to 2001, he worked for Sony Spain, as a Radio frequency Engineer, where he developed analog and digital TV tuners. From 2001 to 2007, he was an part-time Assistant Professor in electronics with the Department of Electronics Engineering, Universitat Autonoma de Barcelona. Funded by the European Marie Curie Program, he worked on devices and circuits reliability at IMEC (Belgium) between 2005 and 2006. From 2008 to 2011, he was a full-time Assistant Professor with the Department of Electronics Engineering, Universitat Politecnica de Catalunya. At present he is an Associate Professor with the Department of Electronics Engineering. He is author or a coauthor of more than 110 papers in international journals and conferences and he has been involved in 18 research projects (6 as principal researcher) in different research activities including reliability, electromagnetic compatibility and electronic textile. His current scientific interest is focused on wearable sensor development for sport and health applications.
Dr. Fernandez was a recipient of the Best Paper Awards at IPFA 2007.View more
Contact IEEE to Subscribe

References

References is not available for this document.