I. Introduction
Poly-(meta-phenylene isophthalamide) (PMIA) has garnered significant attention in the past decade due to its superior dielectric strength, mechanical properties, and thermal stability [1], [2]. Aramid papers and films, which are fabricated from PMIA fibers [3], inherit all of the aforementioned advantages and have found widespread applications as insulation protection materials in electrical and electronic equipment, such as transformer winding insulation [4] and motor coil insulation [5]. However, the intrinsic thermal conductivity of PMIA fibers, which is below 0.2 W/(), limits its ability to effectively dissipate heat during the operation of high-power electrical equipment [6], [7]. The localized heat accumulation can accelerate insulation aging and potentially lead to thermal breakdown faults [8]. Hence, further modification is required to enhance the thermal conductivity of the aramid-based composite.