Analysis and Prospects of Using Ultrafine-Grain Copper for Highly Loaded Cable Systems

This scientific article delves into the analysis and prospects of utilizing ultrafine-grain copper for highly loaded cable systems. The potential applications of new ultra-fine-grained and nanostructured metal conductors in various fields, such as heavily loaded cable systems, windings of motors and generators, low-current computer networks, and devices operating under challenging conditions were explored. The article presents detailed analyses of the mechanical and electrical properties of ultrafine-grained copper and copper alloys. The influence of several plastic deformation on these properties is explored, and the results demonstrate a significant increase in the strength characteristics of the materials due to nanostructuring. However, the electrical conductivity of ultrafine-grained metals, including copper, is a complex phenomenon and depends on various factors, such as defects accumulated at grain boundaries. The research includes theoretical approaches, such as percolation models, to study and understand the electrical conductivity of ultrafine-grained copper. The obtained results revealed the evolution of the structure during intense deformation, showing a decrease in the size of the coherent scattering region and the presence of microstrains in the ultrafine-grained copper structure. These structural changes significantly impact the mechanical and electrical properties of the material, making it important to comprehend and optimize the applications of ultrafine-grained copper in electrical and energy systems.

I. Introduction

In the realm of developing new ultra-fine-grained (UFG) and nanostructured metal conductors, researchers are actively investigating their potential applications in heavily loaded cable systems, windings of motors and generators, low-current computer networks, and devices operating under challenging conditions [1]. Commonly, pure copper and its alloys are utilized as metallic conductor materials. The challenge of enhancing the strength of copper alloys while maintaining high electrical conductivity has been addressed through technologies for obtaining ultrafine-grained and nanostructured materials.