I. Introduction
In recent years, GaN HEMTs have been comprehensively demonstrated and adopted as RF switches in the signal conversion units of satellite communication systems (VSAT) or hub stations. For 5G communication systems, RF switches require lower insertion losses, especially at the signal-receiving end. At present, the optimization of GaN HEMT switching devices mainly starts from the structure and materials. On the one hand, NGES has reported on a new transistor structure based on GaN super lattice channels and 3D gates, named SLCFET (Superlattice castle field effect transistor), and has found that the multi-channel structure had a significant reduction in on-resistance, which greatly optimized the insertion loss of RF switches [1]. On the other hand, InAlN epitaxial materials have been extensively studied in low-voltage and high-frequency applications [2]. Compared with conventional AlGaN/GaN hetero structures, lattice-matched In0.17Al0.83N/GaN heterostructures are more suitable for HEMT low-insertion loss switching devices because of higher carrier mobility and higher two-dimensional electrical concentration. However, little has been reported about InAlN/GaN HEMT RF switches. In this paper, the effects of two different epitaxial designs on the performance of RF switches are systematically compared, which provides a broader idea for designing HEMT switches based on InAlN double-channel.