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A Low-Power Radiation-Hardened Ka-Band CMOS Phased-Array Receiver for Small Satellite Constellation | IEEE Journals & Magazine | IEEE Xplore

A Low-Power Radiation-Hardened Ka-Band CMOS Phased-Array Receiver for Small Satellite Constellation


Abstract:

This article introduces a low-power radiation-hardened Ka -band CMOS phased-array receiver for the low Earth orbit (LEO) small satellite communication system. As the a...Show More

Abstract:

This article introduces a low-power radiation-hardened Ka -band CMOS phased-array receiver for the low Earth orbit (LEO) small satellite communication system. As the available solar panel area limits the power consumption of the receiver, a multi-coupling common-gate (CG) low noise amplifier (LNA) with current-sharing topology and built-in 180° phase shifter is proposed in this work to solve the power issue. The multi-coupling LNA utilizes three coupling inductors to reduce the input matching impedance with a smaller input CMOS transistor size. After implementing the proposed technique, a single beamformer realized a 3.4-mW typical power consumption compared with the conventional works with 17.3–195-mW power consumption. The receiver with magnetic-tuning phase shifter (MTPS) has 0.06-dB/Mrad gain and 0.4°/Mrad phase degradations and is the lowest reported root-mean-square phase and gain errors due to radiation. The proposed receiver achieves −22-dBm IIP3 with a 3.8-dB noise figure. The required on-chip area for each element is only 0.2 mm2. In the over-the-air (OTA) measurement, digital video broadcasting-second generation extension (DVB-S2x) standard modulated signals of up to 256 amplitude phase shift keying (APSK) can be supported by the proposed large array modules. This work realizes −33.2-dB error vector magnitude (EVM) and 12.8-Gb/s link speed with 1.6-GHz channel bandwidth. The measured beam pattern can cover radiated angle from −50° to +50° with lower than −10-dBc sidelobe level. Because of the proposed multi-coupling LNA and MTPS, a low-power radiation-hardened phased-array receiver for small LEO satellites can be achieved in this work.
Published in: IEEE Journal of Solid-State Circuits ( Volume: 59, Issue: 2, February 2024)
Page(s): 349 - 363
Date of Publication: 14 September 2023

ISSN Information:

Funding Agency:

Author image of Xi Fu
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Xi Fu (Member, IEEE) received the B.E. degree (Hons.) from the Dalian University of Technology, Dalian, Liaoning, China, in 2017, and the M.E. and Ph.D. degrees from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019 and 2022, respectively.
He is currently a Post-Doctoral Researcher with the Tokyo Institute of Technology. His current research interests...Show More
Xi Fu (Member, IEEE) received the B.E. degree (Hons.) from the Dalian University of Technology, Dalian, Liaoning, China, in 2017, and the M.E. and Ph.D. degrees from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019 and 2022, respectively.
He is currently a Post-Doctoral Researcher with the Tokyo Institute of Technology. His current research interests...View more
Author image of Dongwon You
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Dongwon You (Student Member, IEEE) received the B.S. degree in electrical and computer engineering from Ajou University, Suwon, South Korea, in 2017, and the M.S. degree in electrical and electronic engineering from the Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include CMOS radio...Show More
Dongwon You (Student Member, IEEE) received the B.S. degree in electrical and computer engineering from Ajou University, Suwon, South Korea, in 2017, and the M.S. degree in electrical and electronic engineering from the Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include CMOS radio...View more
Author image of Yun Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Yun Wang (Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China, Chengdu, China, in 2011 and 2014, respectively, and the Ph.D. degree in physical electronics from the Tokyo Institute of Technology, Tokyo, Japan, in 2019.
He was an Intern with the Pohang University of Science and Technology, Pohang, South Korea, in 2013, and the Device Technology Laboratories, NTT...Show More
Yun Wang (Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China, Chengdu, China, in 2011 and 2014, respectively, and the Ph.D. degree in physical electronics from the Tokyo Institute of Technology, Tokyo, Japan, in 2019.
He was an Intern with the Pohang University of Science and Technology, Pohang, South Korea, in 2013, and the Device Technology Laboratories, NTT...View more
Author image of Xiaolin Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Xiaolin Wang (Student Member, IEEE) received the B.E. degree in electrical engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2020, and the M.E. degree from the Tokyo Institute of Technology, Tokyo, Japan, where he is currently pursuing the Ph.D. degree.
His research interests include CMOS millimeter-wave transceiver, satellite communication, and phased-array transceiver.
Xiaolin Wang (Student Member, IEEE) received the B.E. degree in electrical engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2020, and the M.E. degree from the Tokyo Institute of Technology, Tokyo, Japan, where he is currently pursuing the Ph.D. degree.
His research interests include CMOS millimeter-wave transceiver, satellite communication, and phased-array transceiver.View more
Author image of Ashibir Aviat Fadila
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Ashibir Aviat Fadila (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from the Institut Teknologi Bandung, Bandung, Indonesia, in 2015, and the M.S. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2020, where he is currently pursuing the Ph.D. degree.
From 2015 to 2016, he was a Standard Cells Mask Layout Engineer with Marvell Technology ...Show More
Ashibir Aviat Fadila (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from the Institut Teknologi Bandung, Bandung, Indonesia, in 2015, and the M.S. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2020, where he is currently pursuing the Ph.D. degree.
From 2015 to 2016, he was a Standard Cells Mask Layout Engineer with Marvell Technology ...View more
Author image of Chenxin Liu
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Chenxin Liu (Graduate Student Member, IEEE) received the B.E. degree from the Nanjing University of Science and Technology, Nanjing, China, in 2019, and the M.E. degree in electrical and electronic engineering from the Tokyo Institute of Technology, Tokyo, Japan, in 2021, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include millimeter-wave wireless...Show More
Chenxin Liu (Graduate Student Member, IEEE) received the B.E. degree from the Nanjing University of Science and Technology, Nanjing, China, in 2019, and the M.E. degree in electrical and electronic engineering from the Tokyo Institute of Technology, Tokyo, Japan, in 2021, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include millimeter-wave wireless...View more
Author image of Sena Kato
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Sena Kato (Student Member, IEEE) received the B.E. degree from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan, in 2023, where he is currently pursuing the M.S. degree in electrical and electronic engineering.
His research interests include CMOS millimeter-wave transceiver systems, fifth-generation (5G) communication, phased-array transceiver, and wireless power transfer...Show More
Sena Kato (Student Member, IEEE) received the B.E. degree from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan, in 2023, where he is currently pursuing the M.S. degree in electrical and electronic engineering.
His research interests include CMOS millimeter-wave transceiver systems, fifth-generation (5G) communication, phased-array transceiver, and wireless power transfer...View more
Author image of Chun Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Chun Wang received the B.E. degree from the University of Electronic Science and Technology of China, Chengdu, China, in 2015, and the M.E. degree from Zhejiang university, Hangzhou, China, in 2018. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, with a focus on millimeter-wave front end and system design.
His current research interest...Show More
Chun Wang received the B.E. degree from the University of Electronic Science and Technology of China, Chengdu, China, in 2015, and the M.E. degree from Zhejiang university, Hangzhou, China, in 2018. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, with a focus on millimeter-wave front end and system design.
His current research interest...View more
Author image of Zheng Li
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Zheng Li (Member, IEEE) received the B.E. and M.E. degrees in microelectronics and solid electronics from Xidian University, Xi’an, China, in 2014 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, working on fifth-generation (5G) and beyond-5G wireless communication system design.
His current research interests in...Show More
Zheng Li (Member, IEEE) received the B.E. and M.E. degrees in microelectronics and solid electronics from Xidian University, Xi’an, China, in 2014 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, working on fifth-generation (5G) and beyond-5G wireless communication system design.
His current research interests in...View more
Author image of Jian Pang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Jian Pang (Member, IEEE) received the bachelor’s and master’s degrees from Southeast University, Nanjing, China, in 2012 and 2014, respectively, and the Ph.D. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2019.
From 2019 to 2020, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology, where he was a Special-Appointed Assistant Professor from 2020 to 20...Show More
Jian Pang (Member, IEEE) received the bachelor’s and master’s degrees from Southeast University, Nanjing, China, in 2012 and 2014, respectively, and the Ph.D. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2019.
From 2019 to 2020, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology, where he was a Special-Appointed Assistant Professor from 2020 to 20...View more
Author image of Atsushi Shirane
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Atsushi Shirane (Member, IEEE) received the B.E. degree in electrical and electronic engineering and the M.E. and Ph.D. degrees in electronics and applied physics from the Tokyo Institute of Technology, Tokyo, Japan, in 2010, 2012, and 2015, respectively.
From 2015 to 2017, he was with Toshiba Corporation, Kawasaki, Japan, where he developed 802.11ax wireless Local Area Network (LAN) RF transceiver. From 2017 to 2018, he w...Show More
Atsushi Shirane (Member, IEEE) received the B.E. degree in electrical and electronic engineering and the M.E. and Ph.D. degrees in electronics and applied physics from the Tokyo Institute of Technology, Tokyo, Japan, in 2010, 2012, and 2015, respectively.
From 2015 to 2017, he was with Toshiba Corporation, Kawasaki, Japan, where he developed 802.11ax wireless Local Area Network (LAN) RF transceiver. From 2017 to 2018, he w...View more
Author image of Kenichi Okada
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Kenichi Okada (Fellow, IEEE) received the B.E., M.E., and Ph.D. degrees in communications and computer engineering from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively.
From 2000 to 2003, he was a Research Fellow of the Japan Society for the Promotion of Science, Kyoto University. In 2003, he joined Tokyo Institute of Technology as an Assistant Professor. He is now a Professor of Electrical and Electr...Show More
Kenichi Okada (Fellow, IEEE) received the B.E., M.E., and Ph.D. degrees in communications and computer engineering from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively.
From 2000 to 2003, he was a Research Fellow of the Japan Society for the Promotion of Science, Kyoto University. In 2003, he joined Tokyo Institute of Technology as an Assistant Professor. He is now a Professor of Electrical and Electr...View more

I. Introduction

Emerging technologies are being developed to improve the wireless communication performances in the fifth-generation (5G) mobile network and beyond [7], [8], [9], [10], [11], [12], [13], [14]. There are two main technical directions for the 5G and beyond. One realistic direction is continually pursuing extremely high data rate network access with super high-frequency bands, such as -band and -band [15], [16], [17]. Another promising direction is non-terrestrial networks with extreme coverage extension, and low energy and cost [10], [18], [19], [20], [21], [22]. This article mainly focuses on the direction of wide coverage and low-energy non-terrestrial networks for the small satellite communication system.

Author image of Xi Fu
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Xi Fu (Member, IEEE) received the B.E. degree (Hons.) from the Dalian University of Technology, Dalian, Liaoning, China, in 2017, and the M.E. and Ph.D. degrees from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019 and 2022, respectively.
He is currently a Post-Doctoral Researcher with the Tokyo Institute of Technology. His current research interests include CMOS radio frequency (RF)/millimeter-wave/terahertz/analog transceivers, phased-array transceivers, mixed-signal systems, fifth-generation (5G)/ sixth-generation (6G) mobile systems, device modeling, and satellite communication systems.
Dr. Xi was a recipient of the Japanese Government Ministry of Education, Culture, Sports, Science and Technology (Japan) (MEXT) Scholarship, the IEEE Solid-State Circuits Society (SSCS) Predoctoral Achievement Award in 2023, the Radio Frequency Integrated Circuits (RFIC) Symposium Best Paper Award in 2019, the IEEE International Solid-State Circuits Conference (ISSCC) Student-Research-Preview Poster Award in 2022, and the IEEE SSCS Student Travel Grant Award in 2022. He serves as a reviewer for the IEEE Transactions on Microwave Theory and Techniques (TMTT), the IEEE Transactions on Very Large Scale Integration (TVLSI) Systems, the IEEE Solid-State Circuits Letters (SSC-L), the IEEE Transactions on Circuits and Systems I (TCAS-I), and the IEEE Transactions on Circuits and Systems II (TCAS-II).
Xi Fu (Member, IEEE) received the B.E. degree (Hons.) from the Dalian University of Technology, Dalian, Liaoning, China, in 2017, and the M.E. and Ph.D. degrees from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019 and 2022, respectively.
He is currently a Post-Doctoral Researcher with the Tokyo Institute of Technology. His current research interests include CMOS radio frequency (RF)/millimeter-wave/terahertz/analog transceivers, phased-array transceivers, mixed-signal systems, fifth-generation (5G)/ sixth-generation (6G) mobile systems, device modeling, and satellite communication systems.
Dr. Xi was a recipient of the Japanese Government Ministry of Education, Culture, Sports, Science and Technology (Japan) (MEXT) Scholarship, the IEEE Solid-State Circuits Society (SSCS) Predoctoral Achievement Award in 2023, the Radio Frequency Integrated Circuits (RFIC) Symposium Best Paper Award in 2019, the IEEE International Solid-State Circuits Conference (ISSCC) Student-Research-Preview Poster Award in 2022, and the IEEE SSCS Student Travel Grant Award in 2022. He serves as a reviewer for the IEEE Transactions on Microwave Theory and Techniques (TMTT), the IEEE Transactions on Very Large Scale Integration (TVLSI) Systems, the IEEE Solid-State Circuits Letters (SSC-L), the IEEE Transactions on Circuits and Systems I (TCAS-I), and the IEEE Transactions on Circuits and Systems II (TCAS-II).View more
Author image of Dongwon You
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Dongwon You (Student Member, IEEE) received the B.S. degree in electrical and computer engineering from Ajou University, Suwon, South Korea, in 2017, and the M.S. degree in electrical and electronic engineering from the Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include CMOS radio frequency (RF)/millimeter wave/analog transceiver systems, MIMO, mixed signal, wireless communication, device modeling, and satellite communication.
Prof. You was a recipient of the IEEE Solid-State Circuits Society (SSCS) Student Travel Grant Award in 2022, the Best Student Paper Award (First Place) at the 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), and the IEEE Microwave Theory and Techniques Society MTT-Sat Challenge Phase 1, Phase 2, and Phase 3. He serves as a reviewer for the IEEE Journal of Solid-State Circuits and IEEE Microwave Magazine.
Dongwon You (Student Member, IEEE) received the B.S. degree in electrical and computer engineering from Ajou University, Suwon, South Korea, in 2017, and the M.S. degree in electrical and electronic engineering from the Tokyo Institute of Technology (Tokyo Tech), Tokyo, Japan, in 2019, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include CMOS radio frequency (RF)/millimeter wave/analog transceiver systems, MIMO, mixed signal, wireless communication, device modeling, and satellite communication.
Prof. You was a recipient of the IEEE Solid-State Circuits Society (SSCS) Student Travel Grant Award in 2022, the Best Student Paper Award (First Place) at the 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), and the IEEE Microwave Theory and Techniques Society MTT-Sat Challenge Phase 1, Phase 2, and Phase 3. He serves as a reviewer for the IEEE Journal of Solid-State Circuits and IEEE Microwave Magazine.View more
Author image of Yun Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Yun Wang (Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China, Chengdu, China, in 2011 and 2014, respectively, and the Ph.D. degree in physical electronics from the Tokyo Institute of Technology, Tokyo, Japan, in 2019.
He was an Intern with the Pohang University of Science and Technology, Pohang, South Korea, in 2013, and the Device Technology Laboratories, NTT Corporation, Atsugi, Japan, in 2016. From 2019 to 2021, he was a Researcher with the Tokyo Institute of Technology. He is currently an Associate Researcher with Fudan University, Shanghai, China. His research interests include CMOS radio frequency (RF)/millimeter-wave wireless systems, fifth-generation (5G) phased-array mobile system, and satellite communication.
Dr. Wang was a recipient of the Institute of Electronics, Information and Communication Engineers (IEICE) Best Paper Award in 2018, the Best Student Paper Award (First Place) at the 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), and the Seiichi Tejima Research Award in 2021. He serves as a reviewer for the IEEE Journal of Solid-State Circuits, the IEEE Transactions on Circuits and Systems I, and the IEEE Transactions on Microwave Theory and Techniques.
Yun Wang (Member, IEEE) received the B.S. and M.S. degrees from the University of Electronic Science and Technology of China, Chengdu, China, in 2011 and 2014, respectively, and the Ph.D. degree in physical electronics from the Tokyo Institute of Technology, Tokyo, Japan, in 2019.
He was an Intern with the Pohang University of Science and Technology, Pohang, South Korea, in 2013, and the Device Technology Laboratories, NTT Corporation, Atsugi, Japan, in 2016. From 2019 to 2021, he was a Researcher with the Tokyo Institute of Technology. He is currently an Associate Researcher with Fudan University, Shanghai, China. His research interests include CMOS radio frequency (RF)/millimeter-wave wireless systems, fifth-generation (5G) phased-array mobile system, and satellite communication.
Dr. Wang was a recipient of the Institute of Electronics, Information and Communication Engineers (IEICE) Best Paper Award in 2018, the Best Student Paper Award (First Place) at the 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), and the Seiichi Tejima Research Award in 2021. He serves as a reviewer for the IEEE Journal of Solid-State Circuits, the IEEE Transactions on Circuits and Systems I, and the IEEE Transactions on Microwave Theory and Techniques.View more
Author image of Xiaolin Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Xiaolin Wang (Student Member, IEEE) received the B.E. degree in electrical engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2020, and the M.E. degree from the Tokyo Institute of Technology, Tokyo, Japan, where he is currently pursuing the Ph.D. degree.
His research interests include CMOS millimeter-wave transceiver, satellite communication, and phased-array transceiver.
Xiaolin Wang (Student Member, IEEE) received the B.E. degree in electrical engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2020, and the M.E. degree from the Tokyo Institute of Technology, Tokyo, Japan, where he is currently pursuing the Ph.D. degree.
His research interests include CMOS millimeter-wave transceiver, satellite communication, and phased-array transceiver.View more
Author image of Ashibir Aviat Fadila
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Ashibir Aviat Fadila (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from the Institut Teknologi Bandung, Bandung, Indonesia, in 2015, and the M.S. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2020, where he is currently pursuing the Ph.D. degree.
From 2015 to 2016, he was a Standard Cells Mask Layout Engineer with Marvell Technology Indonesia, Jakarta, Indonesia. From 2016 to 2017, he was a Research Assistant with the Institut Teknologi Bandung, worked on research System-on-Chip (SoC) for the Internet of Things (IoT) application. His current research interests include analog-mixed signal, data converter, and synthesizable analog circuit.
Ashibir Aviat Fadila (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from the Institut Teknologi Bandung, Bandung, Indonesia, in 2015, and the M.S. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2020, where he is currently pursuing the Ph.D. degree.
From 2015 to 2016, he was a Standard Cells Mask Layout Engineer with Marvell Technology Indonesia, Jakarta, Indonesia. From 2016 to 2017, he was a Research Assistant with the Institut Teknologi Bandung, worked on research System-on-Chip (SoC) for the Internet of Things (IoT) application. His current research interests include analog-mixed signal, data converter, and synthesizable analog circuit.View more
Author image of Chenxin Liu
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Chenxin Liu (Graduate Student Member, IEEE) received the B.E. degree from the Nanjing University of Science and Technology, Nanjing, China, in 2019, and the M.E. degree in electrical and electronic engineering from the Tokyo Institute of Technology, Tokyo, Japan, in 2021, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include millimeter-wave wireless communication system design.
Chenxin Liu (Graduate Student Member, IEEE) received the B.E. degree from the Nanjing University of Science and Technology, Nanjing, China, in 2019, and the M.E. degree in electrical and electronic engineering from the Tokyo Institute of Technology, Tokyo, Japan, in 2021, where he is currently pursuing the Ph.D. degree in electrical and electronic engineering.
His current research interests include millimeter-wave wireless communication system design.View more
Author image of Sena Kato
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Sena Kato (Student Member, IEEE) received the B.E. degree from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan, in 2023, where he is currently pursuing the M.S. degree in electrical and electronic engineering.
His research interests include CMOS millimeter-wave transceiver systems, fifth-generation (5G) communication, phased-array transceiver, and wireless power transfer systems.
Sena Kato (Student Member, IEEE) received the B.E. degree from the Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan, in 2023, where he is currently pursuing the M.S. degree in electrical and electronic engineering.
His research interests include CMOS millimeter-wave transceiver systems, fifth-generation (5G) communication, phased-array transceiver, and wireless power transfer systems.View more
Author image of Chun Wang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Chun Wang received the B.E. degree from the University of Electronic Science and Technology of China, Chengdu, China, in 2015, and the M.E. degree from Zhejiang university, Hangzhou, China, in 2018. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, with a focus on millimeter-wave front end and system design.
His current research interests include F-band and 300G transceivers for wireless communications.
Chun Wang received the B.E. degree from the University of Electronic Science and Technology of China, Chengdu, China, in 2015, and the M.E. degree from Zhejiang university, Hangzhou, China, in 2018. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, with a focus on millimeter-wave front end and system design.
His current research interests include F-band and 300G transceivers for wireless communications.View more
Author image of Zheng Li
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Zheng Li (Member, IEEE) received the B.E. and M.E. degrees in microelectronics and solid electronics from Xidian University, Xi’an, China, in 2014 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, working on fifth-generation (5G) and beyond-5G wireless communication system design.
His current research interests include radio frequency (RF)/millimeter-wave CMOS phased-array beamformers, 5G area-power-efficient power amplifiers, and 5G high-data-rate mobile systems.
Zheng Li (Member, IEEE) received the B.E. and M.E. degrees in microelectronics and solid electronics from Xidian University, Xi’an, China, in 2014 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical and electronic engineering with the Tokyo Institute of Technology, Tokyo, Japan, working on fifth-generation (5G) and beyond-5G wireless communication system design.
His current research interests include radio frequency (RF)/millimeter-wave CMOS phased-array beamformers, 5G area-power-efficient power amplifiers, and 5G high-data-rate mobile systems.View more
Author image of Jian Pang
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Jian Pang (Member, IEEE) received the bachelor’s and master’s degrees from Southeast University, Nanjing, China, in 2012 and 2014, respectively, and the Ph.D. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2019.
From 2019 to 2020, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology, where he was a Special-Appointed Assistant Professor from 2020 to 2022.
Dr. Pang was a recipient of the IEEE SSCS Student Travel Grant Award in 2016, the IEEE SSCS Pre-Doctoral Achievement Award for the term 2018-2019, the Seiichi Tejima Oversea Student Research Award in 2020 and the IEEE Microwave Theory and Techniques Society (MTT-S) Japan Young Engineer Award in 2021.
Jian Pang (Member, IEEE) received the bachelor’s and master’s degrees from Southeast University, Nanjing, China, in 2012 and 2014, respectively, and the Ph.D. degree from the Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, Japan, in 2019.
From 2019 to 2020, he was a Post-Doctoral Researcher with the Tokyo Institute of Technology, where he was a Special-Appointed Assistant Professor from 2020 to 2022.
Dr. Pang was a recipient of the IEEE SSCS Student Travel Grant Award in 2016, the IEEE SSCS Pre-Doctoral Achievement Award for the term 2018-2019, the Seiichi Tejima Oversea Student Research Award in 2020 and the IEEE Microwave Theory and Techniques Society (MTT-S) Japan Young Engineer Award in 2021.View more
Author image of Atsushi Shirane
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Atsushi Shirane (Member, IEEE) received the B.E. degree in electrical and electronic engineering and the M.E. and Ph.D. degrees in electronics and applied physics from the Tokyo Institute of Technology, Tokyo, Japan, in 2010, 2012, and 2015, respectively.
From 2015 to 2017, he was with Toshiba Corporation, Kawasaki, Japan, where he developed 802.11ax wireless Local Area Network (LAN) RF transceiver. From 2017 to 2018, he was with Nidec corporation, Kawasaki, where he researched on intelligent motor with wireless communication. He is currently an Associate Professor with the Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Innovative Research, Tokyo Institute of Technology. His current research interests include RF CMOS transceivers for the Internet of Things (IoT), fifth-generation (5G), and satellite communication and wireless power transfer.
Dr. Shirane has been a member of the Technical Program Committee of the IEEE International Solid-State Circuits Conference Student Research Preview since 2019. He is a member of the IEEE Solid-State Circuits Society and the Institute of Electronics, Information and Communication Engineers (IEICE).
Atsushi Shirane (Member, IEEE) received the B.E. degree in electrical and electronic engineering and the M.E. and Ph.D. degrees in electronics and applied physics from the Tokyo Institute of Technology, Tokyo, Japan, in 2010, 2012, and 2015, respectively.
From 2015 to 2017, he was with Toshiba Corporation, Kawasaki, Japan, where he developed 802.11ax wireless Local Area Network (LAN) RF transceiver. From 2017 to 2018, he was with Nidec corporation, Kawasaki, where he researched on intelligent motor with wireless communication. He is currently an Associate Professor with the Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Innovative Research, Tokyo Institute of Technology. His current research interests include RF CMOS transceivers for the Internet of Things (IoT), fifth-generation (5G), and satellite communication and wireless power transfer.
Dr. Shirane has been a member of the Technical Program Committee of the IEEE International Solid-State Circuits Conference Student Research Preview since 2019. He is a member of the IEEE Solid-State Circuits Society and the Institute of Electronics, Information and Communication Engineers (IEICE).View more
Author image of Kenichi Okada
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Tokyo, Japan
Kenichi Okada (Fellow, IEEE) received the B.E., M.E., and Ph.D. degrees in communications and computer engineering from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively.
From 2000 to 2003, he was a Research Fellow of the Japan Society for the Promotion of Science, Kyoto University. In 2003, he joined Tokyo Institute of Technology as an Assistant Professor. He is now a Professor of Electrical and Electronic Engineering at Tokyo Institute of Technology, Tokyo, Japan. He has authored or coauthored more than 500 journal and conference papers. His current research interests include millimeter-wave and terahertz CMOS wireless transceivers for 20/28/39/60/77/79/100/300GHz for 5G, WiGig, satellite and future wireless system, digital phase-locked loop (PLL), synthesizable PLL, atomic clock, and ultra-low-power wireless transceivers for Bluetooth Low-Energy, and Sub-GHz applications.
Prof. Okada is a member of the Institute of Electrical and Electronics Engineers (IEEE), the Institute of Electronics, Information and Communication Engineers (IEICE), the Information Processing Society of Japan (IPSJ), and the Japan Society of Applied Physics (JSAP). He is/was a member of the technical program committees of IEEE International Solid-State Circuits Conference (ISSCC), VLSI Circuits Symposium, European Solid-State Circuits Conference (ESSCIRC), Radio Frequency Integrated Circuits Symposium (RFIC), Asian Solid-State Circuits Conference (A-SSCC), He was a recipient or co-recipient of the Ericsson Young Scientist Award in 2004, the A-SSCC Outstanding Design Award in 2006 and 2011, the Asia and South Pacific Design Automation Conference (ASP-DAC) Special Feature Award in 2011 and Best Design Award in 2014 and 2015, the Ministry of Education, Culture, Sports, Science and Technology (Japan) (MEXT) Young Scientists’ Prize in 2011, the Japan Society for the Promotion of Science (JSPS) Prize in 2014, the Suematsu Yasuharu Award in 2015, the MEXT Prizes for Science and Technology in 2017, the Radio-Frequency Integration Technology (RFIT) Best Paper Award in 2017, the IEICE Best Paper Award in 2018, the RFIC Symposium Best Student Paper Award in 2019, the IEICE Achievement Award in 2019, the DOCOMO Mobile Science Award in 2019, the IEEE/Association for Computing Machinery (ACM) ASP-DAC, Prolific Author Award in 2020, the Kenjiro Takayanagi Achivement Award in 2020, the Kokusai Denshin Denwa Inc. (KDDI) Foundation Award in 2020, the IEEE Custom Integrated Circuits Conference (CICC), Best Paper Award in 2020, and more than 50 other international and domestic awards. He also is/was Guest Editors and an Associate Editor of IEEE Journal of Solid-State Circuits (JSSC), an Associate Editor of IEEE Transactions on Microwave Theory and Techniques (T-MTT), a Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS).
Kenichi Okada (Fellow, IEEE) received the B.E., M.E., and Ph.D. degrees in communications and computer engineering from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively.
From 2000 to 2003, he was a Research Fellow of the Japan Society for the Promotion of Science, Kyoto University. In 2003, he joined Tokyo Institute of Technology as an Assistant Professor. He is now a Professor of Electrical and Electronic Engineering at Tokyo Institute of Technology, Tokyo, Japan. He has authored or coauthored more than 500 journal and conference papers. His current research interests include millimeter-wave and terahertz CMOS wireless transceivers for 20/28/39/60/77/79/100/300GHz for 5G, WiGig, satellite and future wireless system, digital phase-locked loop (PLL), synthesizable PLL, atomic clock, and ultra-low-power wireless transceivers for Bluetooth Low-Energy, and Sub-GHz applications.
Prof. Okada is a member of the Institute of Electrical and Electronics Engineers (IEEE), the Institute of Electronics, Information and Communication Engineers (IEICE), the Information Processing Society of Japan (IPSJ), and the Japan Society of Applied Physics (JSAP). He is/was a member of the technical program committees of IEEE International Solid-State Circuits Conference (ISSCC), VLSI Circuits Symposium, European Solid-State Circuits Conference (ESSCIRC), Radio Frequency Integrated Circuits Symposium (RFIC), Asian Solid-State Circuits Conference (A-SSCC), He was a recipient or co-recipient of the Ericsson Young Scientist Award in 2004, the A-SSCC Outstanding Design Award in 2006 and 2011, the Asia and South Pacific Design Automation Conference (ASP-DAC) Special Feature Award in 2011 and Best Design Award in 2014 and 2015, the Ministry of Education, Culture, Sports, Science and Technology (Japan) (MEXT) Young Scientists’ Prize in 2011, the Japan Society for the Promotion of Science (JSPS) Prize in 2014, the Suematsu Yasuharu Award in 2015, the MEXT Prizes for Science and Technology in 2017, the Radio-Frequency Integration Technology (RFIT) Best Paper Award in 2017, the IEICE Best Paper Award in 2018, the RFIC Symposium Best Student Paper Award in 2019, the IEICE Achievement Award in 2019, the DOCOMO Mobile Science Award in 2019, the IEEE/Association for Computing Machinery (ACM) ASP-DAC, Prolific Author Award in 2020, the Kenjiro Takayanagi Achivement Award in 2020, the Kokusai Denshin Denwa Inc. (KDDI) Foundation Award in 2020, the IEEE Custom Integrated Circuits Conference (CICC), Best Paper Award in 2020, and more than 50 other international and domestic awards. He also is/was Guest Editors and an Associate Editor of IEEE Journal of Solid-State Circuits (JSSC), an Associate Editor of IEEE Transactions on Microwave Theory and Techniques (T-MTT), a Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS).View more
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