I. Introduction
Recently it has been demonstrated that silicon can host optical defects with single-photon emission in the near IR [1] . Notably, the W centre is a tri-interstitial complex characterized by a sharp zero phonon line (ZPL) at 1218 nm (1.018 eV) [2] . It is considered to have a trigonal geometry, and five defective alternative configurations of the centre have been proposed so far. Based on classical molecular dynamics (CMD) simulations and density functional theory (DFT) calculations, the so-called I 3 -V complex is the most energetically favourable candidate [3] . Furthermore, it has been recently demonstrated that the W center can be isolated at the single-photon emitter level, thus offering an enticing platform for integrated silicon photonics based on native defects. In this perspective, the manufacturing of single-photon sources based on W centers at the wafer scale relies on the technological capability of their controlled placement in high-purity silicon substrates. For this goal, mature ion implantation techniques are required to deliver single impurities with high spatial resolution. On the other hand, highly efficient post-implantation processes play a crucial role in enabling their optical activation upon conversion into stable lattice defects. So far, W-centre photoluminescence emission optimization has been studied upon silicon implantation to create self-interstitial defects [4] . However, the increasing interest in the scientific community for realizing novel deterministic silicon-based single photon sources has been pursued by introducing different impurities in the silicon lattice [5] . Therefore, this work investigates the suitability of ion implantation for the fabrication of W centres. The study relies on C keV ion implantation and subsequent multiple-step rapid thermal annealing processes. In this way, these results offer insight into the concurrent kinetics factors involved in incorporating carbon impurities.