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New Resonant Probes With High Detection Sensitivity and Measurement Characteristic of Two Orthogonal Magnetic-Field Components | IEEE Journals & Magazine | IEEE Xplore

New Resonant Probes With High Detection Sensitivity and Measurement Characteristic of Two Orthogonal Magnetic-Field Components


Abstract:

In this article, two new magnetic-field resonant probes, which have high detection sensitivity and measurement characteristic of two orthogonal magnetic-field components,...Show More

Abstract:

In this article, two new magnetic-field resonant probes, which have high detection sensitivity and measurement characteristic of two orthogonal magnetic-field components, are developed and fabricated on a four-layer printed circuit boards (PCBs). Designed probes are composed of a U-shaped loop with a shorted strip (Probe A), two orthogonal shorted loops (Probe B), two 50- \Omega strip lines, and a pair of inductor–capacitor (LC) resonant strips. In order to prevent unwanted electromagnetic modes, several rows of via fences are inserted into these probes. First, two different detection structures are utilized to test two magnetic-field components. Second, a pair of LC resonant strips are used to enhance the detection sensitivity by exciting the resonant point at 1.575 GHz. Finally, the proposed probes are simulated, manufactured, and measured experimentally to evaluate the accuracy of design. Experimental results demonstrate that these new resonant probes can not only simultaneously test two orthogonal magnetic-field components but also exhibit high detection sensitivity at 1.575 GHz.
Published in: IEEE Sensors Journal ( Volume: 23, Issue: 17, 01 September 2023)
Page(s): 19476 - 19482
Date of Publication: 26 July 2023

ISSN Information:

Author image of Lei Wang
School of Microelectronics, Xidian University, Xi’an, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
Lei Wang was born in Shaanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2017, where he is currently pursuing the Ph.D. degree.
He was an Engineer with China Electronic Produce Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His research interests include electromagnetic compatibility an...Show More
Lei Wang was born in Shaanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2017, where he is currently pursuing the Ph.D. degree.
He was an Engineer with China Electronic Produce Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His research interests include electromagnetic compatibility an...View more
Author image of Xiaoxian Liu
School of Microelectronics, Xidian University, Xi’an, China
Xiaoxian Liu received the B.S. degree in electronic science and technology from the Shaanxi University of Science and Technology, Xi’an, China, in 2010, and the Ph.D. degree in microelectronics and solid-state electronics from Xidian University, Xi’an, in 2015.
She is currently a Professor with the School of Microelectronics, Xidian University. Her current research interests include RF integrated circuits and systems and 3...Show More
Xiaoxian Liu received the B.S. degree in electronic science and technology from the Shaanxi University of Science and Technology, Xi’an, China, in 2010, and the Ph.D. degree in microelectronics and solid-state electronics from Xidian University, Xi’an, in 2015.
She is currently a Professor with the School of Microelectronics, Xidian University. Her current research interests include RF integrated circuits and systems and 3...View more
Author image of Guoguang Lu
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
Guoguang Lu received the Ph.D. degree in condensed matter physics from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China, in 2007.
Since 2007, he has been a Senior Engineer of Science and Technology on Reliability Physics with China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current interests include ...Show More
Guoguang Lu received the Ph.D. degree in condensed matter physics from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China, in 2007.
Since 2007, he has been a Senior Engineer of Science and Technology on Reliability Physics with China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current interests include ...View more
Author image of Zhangming Zhu
School of Microelectronics, Xidian University, Xi’an, China
Zhangming Zhu received the B.S., M.S., and Ph.D. degrees in microelectronics from Xidian University, Xi’an, China, in 2000, 2003, and 2004, respectively.
He is currently a Professor with the School of Microelectronics, Xidian University. His current research interests include low-power mixed-signal integrated circuits, successive approximation register analog-to-digital converter (ADC), high-speed ADC/digital-to-analog con...Show More
Zhangming Zhu received the B.S., M.S., and Ph.D. degrees in microelectronics from Xidian University, Xi’an, China, in 2000, 2003, and 2004, respectively.
He is currently a Professor with the School of Microelectronics, Xidian University. His current research interests include low-power mixed-signal integrated circuits, successive approximation register analog-to-digital converter (ADC), high-speed ADC/digital-to-analog con...View more

I. Introduction

As integrated circuits develop toward miniaturization, higher speeds, multifunctionality, and high levels of integrations, electromagnetic interference (EMI) is expected to become increasingly problematic. Near-field scanning systems [1], [2], [3], [4] are commonly used to identify the EMI positions and track transmission paths. The core component of such systems is the near-field probe, which commonly uses an electrically small shorted loop to measure a magnetic-field component and an open-ended monopole to receive a vertical electric-field component. Recent research efforts have focused on increasing the bandwidth [5], [6], enhancing the sensitivity [7], [8], [9], [10], improving the electric-field suppression [11], [12], [13], and expending the spatial resolution [14], [15], [16], [17] of the probes. High-sensitivity probes are used to capture low EMI radiation signals that cannot be sense by conventional probes. In general, it has been found that the introduction of the inductor–capacitor (LC) resonant circuits and active amplifier circuits can significantly improve the detection sensitivity of the probes [5], [6], [7], [8], [9]. Multicomponent probes [18], [19], [20], which could measure multiple field components simultaneously and thus save measurement time, are also currently a popular research topic. However, there is no existing research on high-sensitivity, multicomponent probes. From an application perspective, there is much value to be had from the development of a multicomponent resonant probe.

Author image of Lei Wang
School of Microelectronics, Xidian University, Xi’an, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
Lei Wang was born in Shaanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2017, where he is currently pursuing the Ph.D. degree.
He was an Engineer with China Electronic Produce Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His research interests include electromagnetic compatibility analysis, design of antennas and near-field probes, and failure analysis of bbreak electronic component.
Lei Wang was born in Shaanxi, China, in 1991. He received the B.S. and M.S. degrees in electromagnetic field and microwave technology from Xidian University, Xian, China, in 2017, where he is currently pursuing the Ph.D. degree.
He was an Engineer with China Electronic Produce Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His research interests include electromagnetic compatibility analysis, design of antennas and near-field probes, and failure analysis of bbreak electronic component.View more
Author image of Xiaoxian Liu
School of Microelectronics, Xidian University, Xi’an, China
Xiaoxian Liu received the B.S. degree in electronic science and technology from the Shaanxi University of Science and Technology, Xi’an, China, in 2010, and the Ph.D. degree in microelectronics and solid-state electronics from Xidian University, Xi’an, in 2015.
She is currently a Professor with the School of Microelectronics, Xidian University. Her current research interests include RF integrated circuits and systems and 3-D integrated circuits and systems.
Xiaoxian Liu received the B.S. degree in electronic science and technology from the Shaanxi University of Science and Technology, Xi’an, China, in 2010, and the Ph.D. degree in microelectronics and solid-state electronics from Xidian University, Xi’an, in 2015.
She is currently a Professor with the School of Microelectronics, Xidian University. Her current research interests include RF integrated circuits and systems and 3-D integrated circuits and systems.View more
Author image of Guoguang Lu
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
Guoguang Lu received the Ph.D. degree in condensed matter physics from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China, in 2007.
Since 2007, he has been a Senior Engineer of Science and Technology on Reliability Physics with China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current interests include electronic component reliability analysis technology, test technology, and evaluation technology.
Guoguang Lu received the Ph.D. degree in condensed matter physics from the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China, in 2007.
Since 2007, he has been a Senior Engineer of Science and Technology on Reliability Physics with China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, China. His current interests include electronic component reliability analysis technology, test technology, and evaluation technology.View more
Author image of Zhangming Zhu
School of Microelectronics, Xidian University, Xi’an, China
Zhangming Zhu received the B.S., M.S., and Ph.D. degrees in microelectronics from Xidian University, Xi’an, China, in 2000, 2003, and 2004, respectively.
He is currently a Professor with the School of Microelectronics, Xidian University. His current research interests include low-power mixed-signal integrated circuits, successive approximation register analog-to-digital converter (ADC), high-speed ADC/digital-to-analog converter, green-power ICs, and 3-D ICs bbreak based on the through-silicon-vias.
Zhangming Zhu received the B.S., M.S., and Ph.D. degrees in microelectronics from Xidian University, Xi’an, China, in 2000, 2003, and 2004, respectively.
He is currently a Professor with the School of Microelectronics, Xidian University. His current research interests include low-power mixed-signal integrated circuits, successive approximation register analog-to-digital converter (ADC), high-speed ADC/digital-to-analog converter, green-power ICs, and 3-D ICs bbreak based on the through-silicon-vias.View more
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